Device Engineer

onsemi•Syracuse, NY

1d•$88,700 - $142,000•Onsite

About The Position

onsemi is seeking a Device Engineer for its semiconductor fabrication facility in Syracuse, New York. The role focuses on yield enhancement, new product introduction, and sustaining and optimization activities for vertical GaN technology in a fast-paced wafer fabrication environment. The engineer will apply semiconductor device knowledge across the full fabrication process, from bare wafers to finished goods, with an emphasis on fab manufacturability. The position regularly interfaces with in-house fab process engineering, technology development, failure analysis, design and layout, wafer probe and test, in-line defect control, quality, and GaN division leadership. The role also requires communicating analyses and coordinating improvement activities across engineering teams and management.

Requirements

MS, PhD, or equivalent in Engineering; Electrical Engineering is preferred. Physics, Chemistry, Chemical Engineering, Materials Engineering, or a related technical field will also be considered.
At least 8 years of experience in a similar job function involving semiconductor power devices and circuits.
Broad understanding of semiconductor device processing, process integration, device physics, failure analysis techniques, and reliability improvement of JFETs.
Problem-solving mindset and a proactive approach to identifying and resolving problems.
Proven ability to use data analysis and statistics to reach conclusions and drive improvement.
Ability to manage multiple projects simultaneously in a fast-paced development environment.
Excellent oral and written communication skills, strong interpersonal skills, and ability to work as part of a team.

Nice To Haves

Experience with GaN technology.
Experience with Design of Experiments (DOEs), statistics for manufacturing engineering, and structured problem-solving methods such as 8D and 5 Whys.

Responsibilities

Drive activities to improve yield, performance, and reliability of vertical GaN transistors.
Enhance process yield for a new generation of GaN power semiconductor devices.
Analyze wafer-level and product-level electrical test data to quantify yield and identify performance improvement opportunities.
Communicate yield analyses to process engineering, technology development, failure analysis, packaging, test, reliability, and management.
Lead structured root-cause analysis for yield, reliability, or device-related issues and implement sustainable corrective solutions.
Work with fab teams to identify yield root causes and define experiments to realize improvements.
Collaborate with process engineering to define process windows and identify process corners.