Device Compact Modeling Engineer (2027 New College Graduate)

GlobalFoundries•Malta, NY

1d•$58,400 - $100,800

About The Position

This position is for a Device Compact Modeling Engineer who will primarily work on digital, analog, and RF compact device model development for GF CMOS technologies. The engineer will collaborate across technology development, characterization, PDK, and design enablement teams to deliver accurate, robust, and production-ready device models for internal and external customers.

Requirements

Graduating with a Bachelor’s degree in Electrical Engineering, Physics or related field from an accredited degree program.
Must have at least an overall 3.0 GPA and proven good academic standing.
English (Written & Verbal) language fluency.
Fundamental knowledge of semiconductor device physics related to compact modeling of different types of devices.
Understanding of semiconductor device noise and matching behaviors.

Nice To Haves

Prior related internship or co-op experience.
Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
Strong written and verbal communication skills
Strong planning & organizational skills
Experience with analog or RF design flow and methodology.
Coding skills in Python, Perl, or other computing languages.
Experience in machine learning and artificial intelligence.
Experience in SPICE model generation and QA flow.
Experience in test structure layout of individual devices and arrays.

Responsibilities

Work on SPICE model development projects covering digital, analog, and RF devices for GF CMOS technologies while meeting project timelines and maintaining high-quality standards.
Drive best practices and standardization in data selection, model extraction, QA, validation, and circuit benchmarking across technology platforms.
Coordinate cross-functional teams including Device Modeling, Characterization Labs, PDK, Device Engineering, Process Integration, Design Manual, and Test Chip Design/Layout teams to execute model-related projects and resolve issues.
Stay current on industry trends and advancements in SPICE modeling methodologies and incorporate innovative techniques into model development flows.
Communicate project progress effectively and provide technical updates to stakeholders.
Participate in customer engagement activities and provide technical support for compact model questions, investigations, and issue resolution.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.