Development Reliability Staff Engineer

onsemi•Scottsdale, AZ

16d•Onsite

About The Position

onsemi is seeking a Reliability Staff Engineer to join its team in Scottsdale, Arizona. This role is a key member of a cross-functional team delivering technology and products that exceed customer expectations for robustness, durability, and reliability. It focuses on ensuring the robustness, durability, and lifetime performance of power semiconductor products, including silicon, silicon carbide (SiC), and gallium nitride (GaN) technologies, discrete devices, and power modules. The successful candidate will provide technical leadership in reliability engineering, with a strong focus on chip–package interactions and advanced power packaging. The position requires deep understanding of electro-thermo-mechanical physics of failure, accelerated reliability testing, power cycling, and statistical analysis, as well as the ability to translate customer mission profiles into qualification strategies. The engineer will advise internal stakeholders and customers, communicate complex reliability concepts, and influence cross-functional decisions. The role is based in Scottsdale, Arizona, and includes travel of less than 10%.

Requirements

Recent graduate or expected graduate by year-end with a Ph.D. in Electrical Engineering, Materials Science, or Mechanical Engineering will be considered.
Master’s degree with 3–5 years of relevant experience.
Strong understanding of physics of failure, particularly electro-thermo-mechanical mechanisms in semiconductor devices and packages.
Proven experience with chip–package interactions, package materials, and assembly processes.
Hands-on experience with power cycling reliability testing and accelerated thermo-mechanical stress.
Experience with power semiconductor products, including Si, SiC, or GaN discrete devices and/or power modules.
Proficiency with structured problem-solving tools such as FMEA, 8D, and root cause analysis.
Experience with statistical analysis tools such as JMP or Minitab, and MS Office.
Willingness to travel less than 10%.
Excellent verbal and written communication skills in English.

Nice To Haves

Experience extracting data and creating reports and dashboards using Power BI, Python, Oracle, and/or SQL.
Knowledge of industry reliability standards, including JEDEC, AEC, IEC, MIL, or AQG324.
Experience working with automotive customers or OEMs.

Responsibilities

Interface with Fab, Packaging, Product Engineering, Manufacturing, and Business Units.
Define and own new product development (NPD) reliability and robustness requirements for power semiconductor products.
Lead reliability assessments for advanced power packaging technologies, such as sintered die attach, copper clip/ribbon, embedded die, power modules, and double-sided cooling.
Analyze chip–package interaction effects and thermo-mechanical failure mechanisms, and propose design, process, or material improvements.
Influence package, device, and process design decisions through data-driven reliability recommendations.
Lead technical reliability discussions to align stakeholders on risk, tradeoffs, and qualification strategy.
Design and execute power cycling, thermal cycling, and accelerated thermo-mechanical stress tests.
Develop, validate, and calibrate lifetime and acceleration models based on physics of failure and test data.
Conduct early-stage FMEA and drive root cause and corrective action (RCCA) for reliability stress failures.
Collaborate with internal laboratories on reliability testing and failure analysis.
Correlate accelerated stress results to customer mission profiles and application use conditions.
Communicate reliability data, physics-of-failure insights, and risk assessments to technical and non-technical stakeholders.
Manage multiple projects in a fast-paced, cross-functional environment.
Provide technical leadership and serve as a trusted reliability advisor to internal stakeholders and customers.