New College Grad - Design Engineer, HBM

Micron TechnologyRichardson, TX

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a build Engineer at Micron Technology, Inc., you will be responsible for crafting and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve design quality and manufacturability. You will coordinate with multi-functional partners to support tape‑out readiness and future technology scaling. This role offers hands‑on impact across the full semiconductor design flow.

Requirements

  • Bachelor’s or Master's degree in Electrical Engineering or a related field.
  • Extensive knowledge of CMOS circuit design and semiconductor device physics.
  • Experience with schematic entry, Verilog, FastSPICE, and HSPICE simulations.
  • Strong understanding of timing, area, power, and complexity trade‑offs in DRAM or mixed‑signal design.
  • Experience using AI-Enabled or AI Assisted tools to support simulation, modeling, data analysis, or engineering productivity improvements

Nice To Haves

  • Strong verbal and written communication skills for conveying complex technical concepts.
  • Exposure to statistical or Monte Carlo simulation techniques and mixed-signal verification workflows.
  • Experience with memory interfaces, HBM architectures, or mixed-signal IP integration through coursework or internships.
  • Prior register‑transfer level (RTL) design flow experience in DRAM or foundry processes.

Responsibilities

  • Contribute to new product opportunities by supporting overall circuit design, layout, and optimization for memory and logic or analog circuits.
  • Perform parasitic modeling and support design validation, including reticle experiments and required tape‑out revisions.
  • Oversee and manage the layout process, including floor‑planning, placement, and routing.
  • Perform verification using modeling and simulation with industry‑standard simulators.
  • Collaborate across teams to drive standardization and shared design success.
  • Partner with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to support accurate manufacturability.
  • Proactively incorporate guidance from standards, computer‑aided design (CAD), modeling, and verification teams to improve design quality.

Benefits

  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income if you are unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
© 2026 Teal Labs, Inc
Privacy PolicyTerms of Service