Design Engineer, Electronics Packaging

MoogBuffalo, NY
Onsite

About The Position

The Space Sector of Moog’s Space and Defense Group (SDG) designs and manufactures systems to survive the harsh environments of space travel. As an industry leader in space avionics, actuation and mechanisms, propulsion, power, structures, and shock and vibration control, Moog has been committed to the space industry for more than 60 years and Moog products have been to every planet. Our team in the Space Sector’s Actuation and Avionics Business Unit is looking for a Design Engineer, Electronics Packaging to engineer electronic assemblies for NASA, military, and commercial space applications. You will report to the Electronics Packaging Manager and work within program teams to help execute different aspects of the design process. This position requires a high degree of foresight and creativity, as well as the ability to work collaboratively in a cross functional team to anticipate and solve unprecedented engineering problems.

Requirements

  • Bachelor’s degree in Mechanical Engineering or related field
  • 5+ years of relevant technical experience, designing and/or testing circuit card assemblies, cabling, and enclosures for electronic control systems
  • Must have the ability to obtain a U.S. Security Clearance.
  • Self-motivated, with strong critical thinking and analytical skills
  • Experience interfacing with customers
  • Proficient communication skills, both in writing technical documentation and in presentations
  • Ability to work onsite in Elma, NY (preferred), Arvada, CO, Huntsville, AL or Chatsworth, CA

Nice To Haves

  • Currently holding a clearance is preferred.

Responsibilities

  • Work cross discipline with the engineering organization to ensure program success.
  • Create conceptual and detailed designs for electronic packaging related tasks including controller layout, interconnect, CCA’s, and cabling.
  • Support manufacturing of PWBs, CCAs, cabling, and machined components associated with electronic packaging.
  • Work in NX to complete 3D solid models and 2D drawings in conjunction with Teamcenter.
  • Execute thermal, structural, and high voltage analysis.
  • Utilizing ANSYS workbench for the thermal and structural analyses.

Benefits

  • great compensation package
  • bonus opportunities
  • matching 401k
  • Employee Stock Purchase Plan (select locations)
  • Flexible Spending and Health Savings Accounts
  • Flexible paid time off
  • holidays
  • parental leave program
  • relocation assistance
  • Comprehensive insurance coverage including medical, dental, vision, life, disability, Employee Assistance Plan (“EAP”) and other supplemental benefit coverages
  • Tuition Assistance
  • mentorship and coaching opportunities
  • leadership development and other personal growth programs
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