This is a Summer Engineering internship position at NXP’s ATMC wafer manufacturing facility, approximately 12 weeks long. The intern will learn the basics of semiconductor manufacturing, technology, and operations. They will work with an experienced engineer mentor to troubleshoot production equipment and process issues within the factory. The intern will drive one or more real projects urgently needed by the fab related to key business metrics (Safety, Quality, Delivery, Cost), deliver real results to the business, and present to factory senior management at the end of the internship. Equipment engineering focuses on optimizing multi-million dollar production equipment (parts, preventative maintenance, cleaning and repair, etc.), while process engineering optimizes the processes (materials, time, temperature, dose, etc.) of the various manufacturing steps. Key challenges include integrating tool improvements across multiple tool types with different operating systems and coordinating multiple activities with shared/limited resources. The role involves cross-functional aspects, working with teams such as Process Engineers, Equipment Engineers, Operations, and Facilities to accomplish testing, improving tool performance, tool installs, tool removals, and tool moves.
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Career Level
Intern