Custom HBM Physical Design Engineer, Member of Technical Staff (MTS)
About The Position
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Custom HBM Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tapeout. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations.
Requirements
- Strong experience in SoC physical design implementation from netlist to GDSII on advanced nodes and complex designs.
- Proficiency with industry EDA tools (e.g., Cadence Innovus/Tempus, Synopsys ICC2/PrimeTime, Siemens Calibre or equivalent).
- Experience with power intent and power delivery considerations (e.g., UPF/CPF concepts, power grid planning, power gating implications).
- Exposure to hierarchical physical design, top-level assembly, partitioning guidelines, and large-scale integration methodology.
- Knowledge of IR/EM analysis, noise, coupling/crosstalk considerations, and mitigation strategies.
- Proven tapeout history on advanced foundries (e.g., TSMC) and understanding of full-cycle SoC development flows.
- Strong scripting/automation skills using Python, TCL, Perl, and/or shell.
Nice To Haves
- Experience with HBM / DRAM adjacent SoC designs, or memory-subsystem-heavy SoCs.
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
- Minimum 15 years of experience in a related field.
Responsibilities
- Own physical implementation for SoC blocks and/or top-level, including floor planning, placement, CTS, routing, and physical optimization to meet PPA targets.
- Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs.
- Collaborate with design and integration teams to ensure clean implementation of clocking/reset strategy, power architecture, and SoC integration requirements.
- Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity.
- Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently.
- Work with packaging, assembly, test, probe, and manufacturing stakeholders to ensure design meets manufacturability and quality requirements.
- Support tapeout execution (checklists, ECO flows, signoff reviews) and contribute to post-silicon debug by correlating silicon behavior with PD/STA/power analysis.
- Identify flow gaps and improve productivity through scripting/automation and best-practice methodology development.
Benefits
- Choice of medical, dental and vision plans
- Benefit programs that help protect your income if you are unable to work due to illness or injury
- Paid family leave
- Robust paid time-off program
- Paid holidays
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What This Job Offers
Job Type
Full-time
Career Level
Senior
Education Level
Associate degree
