Core Technologist, Wiresaw

CorningHemlock, MI
Onsite

About The Position

The Senior Wiresaw Process Engineer will serve as the technical leader for diamond-coated wire (DCW) wafer slicing operations, driving process optimization, quality control, and reliability improvements. This role is critical to ensuring high-quality solar wafer production by leveraging deep expertise in wiresaw slicing parameters, equipment, and materials. The engineer will lead troubleshooting, implement corrective actions, and mentor teams while collaborating cross-functionally to enhance yield, reduce costs, and support continuous innovation in wafer manufacturing.

Requirements

  • Bachelor's degree or higher in engineering, materials science, or a related field
  • 3-5 years of experience in manufacturing or a closely related field, with a proven track record of technical leadership and expertise.
  • In-depth knowledge of solar manufacturing diamond wire saw processes, equipment, and materials.
  • Strong analytical and problem-solving skills, with the ability to identify root causes of technical issues and implement effective solutions.
  • Solve technical issues pertaining to diamond wire saw process used for making thin solar or semiconductor wafers.

Nice To Haves

  • Ability to thrive in a fast-paced and dynamic environment, with a willingness to adapt to changing priorities and requirements.

Responsibilities

  • SME for wiresaw slicing processes, including recipe parameter optimization, throughput increase and equipment maintenance, while ensuring the production of high-quality solar products.
  • Identify opportunities for process optimization to improve yield, reduce costs, and enhance overall efficiency in wiresaw slicing operations.
  • Develop and implement robust quality control measures to ensure the highest standards of wafer quality are maintained, including thickness uniformity, surface roughness, and defect density.
  • Lead efforts to troubleshoot technical issues related to wiresaw slicing, identify root causes, and implement corrective actions to address process deviations and improve process reliability.
  • Maintain accurate documentation of wiresaw slicing processes, procedures, and technical specifications, and prepare comprehensive reports to communicate findings, recommendations, and project updates to stakeholders.
  • Apply statistical analysis, DOE, and SPC methods to optimize processes and ensure data-driven decision-making.

Benefits

  • Company-wide bonuses and long-term incentives
  • 401(k) savings plan with company matching contributions of up to 4% of pay when you contribute at least 6% of pay
  • Medical, dental, vision insurance
  • Paid parental leave
  • Family building support
  • Fitness benefits
  • Company-paid life insurance
  • Disability insurance
  • Disease management programs
  • Paid time off
  • Employee Assistance Program (EAP)
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