Component Quality Engineer

AppleCupertino, CA

About The Position

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. The people here at Apple don’t just create products — they create the kind of wonder that’s revolutionized entire industries. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple, and help us leave the world better than we found it. Apple is seeking a Component and MLB Quality Engineer with a strong background in electrical design, component quality and failure analysis. This role will require collaboration on quality initiatives across multiple different organizations within Apple so a broad experience across consumer circuit design with a focus on manufacturing quality is highly desired. IC Component quality team manages end to end proactive quality of semiconductor silicon ICs, covering Apple silicon latest technologies in the industry such as SoC, DRAM/NAND and PMU to passives, ASICs and Power ICs. Team manages Apple suppliers semiconductor fab/assembly manufacturing and testing process, design debug and FA, quality monitoring, data analytics machine learning, MLB/IC EE, application level etc. With excellent Electrical Engineering skills to work with Product Design, Test, Product Quality, Supplier Quality, Contract Manufacturers, and field organizations to deliver high quality systems. Outstanding program management skill is highly desired. In this role you will also be responsible for managing all aspects of logic board quality, design quality, components, and assemblies.

Requirements

  • Experience in one or more of the following disciplines: Fab Process Operations, Test, Design or Product Engineering, Reliability and/or Qualification
  • Experience in design & manufacturing of systems, PCBAs, assembly, and test
  • Broad IC packaging experience i.e. WLCSP, SOC, QFN, etc.
  • Solid knowledge and experience in Fab process and Package assembly.
  • Strong product reliability knowledge and fundamentals of relevance
  • Excellent skills in failure analysis of systems, circuits, and their components including cross-sectional analysis, Optical Microscopy, X-Ray, SEM/EDS, FTIR, XPS, etc.
  • Familiar with test strategies: In-Circuit Testing, board functional tests, and industry standard test methodologies such as JTAG.
  • Electrical Engineering skills including familiarity with circuit and system design, and manufacturing processes and test.
  • Precise technical communication including deep level of engineering analysis and details.
  • Demonstrated initiative with a high level of energy, and methodical & efficient problem solving skills including engineering DOEs.
  • Experience in system manufacturing, SMT, and transitioning new products into manufacturing.
  • Proven 8D and RCCA based problem solving and transformation.
  • A high level of experience with quality metrics and SPC.
  • Experience working with off-shore manufacturers and traveling to manufacturing sites to perform root cause findings and problem solving

Nice To Haves

  • Industry leadership (such as ASQ) and consumer electronics experience is preferred

Responsibilities

  • Vendor (Fab process, Wafer level test, Final test, and Packaging) facility auditing.
  • Full audit reporting, communication with Suppliers and Apple management and follow up to close all issues
  • Drive and track closure on any component or module issues that impact overall product readiness or DPPM fluctuations
  • Feedback ‘real time’ learning from any sustaining issues
  • Provide quality team approval risk and MP releases and ensure team drives quality requirements for any post-ramp qualification
  • Manage all program-related communication to executive management including:
  • Highlight key program risk to management and clearly explain path to resolution
  • Commit to work under high time/deliverable pressure with solid results
  • Actively participate in detection of component quality & manufacturing issues during development
  • Manage quality reviews, audits and support at vendor/CM sites
  • Prevent and correct quality issues during the sustaining phase
  • Manage all aspects of logic board quality, design quality, components, and assemblies
  • Drive technical root cause analysis and corrective actions to improve system quality.
  • Adapt at identifying risk and develop solid plans to mitigate
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