EnaChip: Component Design Engineer

Anzu Partners•Philadelphia, PA

40d•$90,000 - $115,000•Onsite

About The Position

EnaChip is building a new foundation for power delivery—bringing together advances in materials science, semiconductor processing, and system architecture. Our mission is to remove power delivery as a constraint on technological progress, enabling the next generation of compute systems to reach higher performance, efficiency, and scale. EnaChip is looking for a Component Design Engineer who wants to define, optimize, and own the electroplating process. This is an opportunity to scale a process from R&D to wafer- and panel-level production, working at the leading edge of a platform that's bringing magnetics directly into the semiconductor stack. You'll join a young, growing team, with real opportunities to move into a leadership role as the company scales. This position will work onsite in Philadelphia.

Requirements

Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, or related field
3-5 years of experience with electroplating/electrochemical deposition in a semiconductor or advanced manufacturing environment
Experience with multiple power supply types, bath metrology/monitoring equipment, SPC/DOE and related software (JMP), and thin-film characterization
Knowledge of plating bath chemistry, current density optimization, and thin-film characterization
A strong process-ownership mindset — you define it, you build it, you scale it

Nice To Haves

Experience in a startup or early-stage hardware environment

Responsibilities

Develop and optimize electroplating processes for magnetic alloy deposition
Characterize processes, improve yield, and integrate electroplating with semiconductor fabrication flows
Scale electroplating processes from R&D to wafer- and panel-level production
Collaborate with materials and design teams to tune conductor and magnetic layer properties