This position requires hands-on use of mechanical, chemical, and ion beam deprocessing of microelectronics technology for conducting basic-to-advanced analyses. Use of advanced sample preparation and microscopy to investigate packaging technology and microelectronics will be essential for deriving the mechanical and elemental build-up of current and emerging technology ranging from planar CMOS and FinFet; SOI; GaAs; SiGe, and other semiconductor technologies. Strong communication skills are necessary for translating complex information into simplified terms, especially with documentation and information sharing sessions. Identifying trends and commonalities between related technology systems will be helpful for building a dataset on changing and evolving fabrication methods.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees