Thermal Analysis Engineer

Intel Corporation•Chandler, AZ

2d•Onsite

About The Position

The Thermal Engineer will drive thermal design and analysis for GPU, AI accelerators, and data center products through both simulation and hands-on experimental work. This work in this role will support the enabling high-performance computing while meeting thermal requirements. You will assist in thermal design across silicon, package, and platform levels, supporting thermal performance optimization for advanced computing products, as well as perform laboratory testing and develop innovative thermal characterization methods.

Requirements

PhD in Mechanical Engineering, Thermal Sciences, or related field or MS degree in Mechanical Engineering, Thermal Sciences, or related field with 2+ years working experience in thermal sciences.
Minimum 2+ year of experience with thermal simulation tools (e.g., CFD, FEA) and/or experimental validation.
Minimum 2+ heat transfer fundamentals and/or thermal management principles

Nice To Haves

Hands-on laboratory experience with thermal testing and experimental setup
Ability to design, build, and operate thermal test equipment and instrumentation
2+ years of experience with semiconductor or high-performance computing products
Practical experience with advanced cooling technologies such as immersion cooling, 2-phase cooling, or microchannel heat spreaders
Exposure to GPU/AI hardware thermal challenges
Experience developing innovative thermal metrology and measurement techniques
Experience with data acquisition systems and thermal instrumentation (thermocouples, IR cameras, flow meters, etc.)
Familiarity with statistical analysis and experimental data processing
Understanding of power electronics and energy efficiency concepts
Experience with prototype development and rapid testing methodologies
Track record of translating experimental results into design recommendations

Responsibilities

Support development of packaging thermal solutions for GPU/AI products
Support thermal design strategies for advanced packaging technologies, including chiplets and multi-chip modules
Perform thermal, electrical, and mechanical co-design optimization
Design and execute experiments to characterize thermal performance of advanced package to system-level cooling technologies.
Develop innovative thermal metrology techniques for next-generation thermal management solutions (2-phase cooling systems, and microchannel heat spreaders).
Correlate experimental data with simulation results to improve predictive models
Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance.
Engage with external customers and ecosystem partners to align thermal solutions with product requirements.