Co-Packaged Optics Packaging Process Development Engineer

Marvell Technology • Santa Clara, CA

3d • $141,150 - $211,400

About The Position

Marvell is hiring an engineer to drive packaging process technology development for AI products, from concept through high-volume manufacturing. The role involves working closely with foundries, OSATs, cross-functional packaging teams, and consumable suppliers to develop assembly processes and packaging solutions, with attention to design for manufacturing, reliability, cost, and factory readiness. The engineer will identify and mitigate risks associated with new technologies, mature products through the NPI phase, and help drive qualification and ramp to high-volume manufacturing.

The position includes hands-on wafer process development and 2.5D/3D CoW assembly development, including chemistry development with packaging consumable suppliers. The engineer will manage package qualification with a focus on thermo-mechanical reliability and cost constraints, coordinate internal and external resources toward corporate milestones, and develop advanced package solutions and specifications with vendors. The role requires strong project management, communication, problem-solving, and independent execution.

Requirements

• At least 7 years of experience in semiconductor packaging, process, and technology development.
• Expert-level understanding of advanced foundry process nodes and their interaction with packaging, assembly, and substrates across package technologies.
• Expertise in advanced packaging technologies, including high-density/high-performance interconnects with TSVs in 2.5D/3D package form factors.
• Proven track record bringing products from technology development and package design/definition through qualification, NPI, and high-volume manufacturing.
• Working-level understanding of package architecture, design rules, BOM, enabling material/process technologies, mechanical engineering, design for manufacturing, reliability, and cost.
• Familiarity with component- and system-level reliability, testing, and failure analysis.
• Experience in project management and communicating technical and project/program status and issue resolution at the executive level.
• Strong problem-solving skills, scientific fundamentals, sound engineering judgment, and analytical ability.
• Effective communication skills and comfort engaging internal cross-functional teams and domestic and overseas suppliers.
• Excellent attention to detail; process- and operations-oriented, self-driven, able to work independently, and able to complete projects with minimal supervision.
• M.S. or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or Physics.

Nice To Haves

• Experience with photonics packaging.

Responsibilities

• Lead process development at foundries and 2.5D/3D CoW process development at OSATs, with emphasis on chemistry development with packaging consumable suppliers.
• Bring packaging solutions from concept to prototypes and ramp them to high-volume manufacturing, including aggressive cost-reduction strategies.
• Manage package qualification with attention to physics of failures and high thermo-mechanical reliability within established cost constraints.
• Manage internal and external resources toward established corporate milestones.
• Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts.
• Identify and mitigate risks to new technologies used in product integration and ensure factory readiness by maturing products during the NPI phase.
• Communicate technical and project/program status and issue resolution, including at the executive level.

Benefits

• Eligible to participate in bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
• Employee stock purchase plan with a 2-year look back.
• Family support programs.
• Mental health resources.
• Recognition and service awards.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior