Co-Packaged Optics Packaging Process Development Engineer
About The Position
Marvell is seeking an engineer to drive assembly process technology development for AI products, from concept through high-volume manufacturing. The role works closely with foundries and outsourced semiconductor assembly and test (OSAT) partners to support design for manufacturing, reliability, and cost. It includes identifying and mitigating risks in new product-integration technologies and maturing products during the NPI phase to ensure factory readiness. The position requires hands-on wafer process development experience and collaboration with consumable suppliers on 2.5D/3D chip-on-wafer (CoW) assembly development. The engineer will lead packaging process development, help develop chemistry and advanced package solutions, manage package qualification, and guide products through prototypes and manufacturing ramp. Success requires strong project management, communication, problem-solving, and the ability to prioritize and resolve issues urgently.
Requirements
- At least 7 years of experience in semiconductor packaging, process, and technology development.
- Expert understanding of advanced foundry process nodes and their interaction with packaging, assembly, and substrates across package technologies.
- Expertise in advanced packaging technologies, including high-density/high-performance interconnects with TSVs in 2.5D/3D package form factors.
- Proven track record bringing products through technology development, package design/definition, qualification, NPI, and high-volume manufacturing.
- Working-level understanding of package architecture, design rules, BOM, enabling material and process technologies, mechanical engineering, design for manufacturing, reliability, and cost.
- Familiarity with component- and system-level reliability, testing, and failure analysis.
- Experience in project management and communicating technical and project/program status and issue resolution at the executive level.
- Strong problem-solving skills, science fundamentals, engineering judgment, and analytical ability.
- Effective communication skills and comfort engaging internal cross-functional teams and domestic and overseas suppliers.
- Attention to detail; process- and operations-oriented; self-driven; able to work independently and complete projects with minimal supervision.
- M.S. or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or Physics.
Nice To Haves
- Experience with photonics packaging is preferred but not required.
Responsibilities
- Lead process development at foundries and 2.5D/3D CoW process development with OSATs, emphasizing chemistry development with packaging consumable suppliers.
- Bring packaging solutions from concept to prototypes and ramp them to high-volume manufacturing, using aggressive cost-reduction strategies.
- Manage package qualification with attention to physics of failures and high thermo-mechanical reliability while meeting cost constraints.
- Manage internal and external resources toward established corporate milestones.
- Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI.
- Identify and mitigate risks associated with new technologies used in product integration and ensure factory readiness by maturing products during NPI.
- Work with cross-functional packaging teams and collaborate with foundries, OSATs, vendors, and suppliers.
Benefits
- Eligible to participate in bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
- Employee stock purchase plan with a 2-year look back.
- Family support programs.
- Mental health resources.
- Recognition and service awards.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
