CMOS FEOL Reliability Principal Engineer (2027 New College Graduate)

GlobalFoundries•Malta, NY

2d•$85,000 - $146,000

About The Position

GlobalFoundries is seeking a highly motivated New College Graduate Reliability Engineer to support CMOS FEOL reliability qualification, reliability physics, and lifetime modeling across advanced semiconductor technologies. This role will contribute to qualification execution, Process Reliability Monitoring, technical risk assessment, and cross-functional problem solving with Device Engineering, Process Integration, Product Engineering, Test, Failure Analysis, Manufacturing, and customer-facing teams.

Requirements

Graduating with a Bachelor’s, Master’s, or PhD in Electrical Engineering, Physics, Materials Science, Microelectronics, or related field from an accredited degree program.
Must have at least an overall 3.0 GPA and proven good academic standing.
English (Written & Verbal) Language Fluency
Academic, research, internship, or project experience related to semiconductor reliability, device engineering, technology qualification, semiconductor physics, or data analysis.
Foundational understanding of CMOS reliability mechanisms, statistical analysis, and reliability lifetime projections.
Strong analytical, problem-solving, written communication, and teamwork skills.

Nice To Haves

Prior related internship or co-op experience.
Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
Strong written and verbal communication skills
Strong planning & organizational skills
Graduate-level research or project experience with advanced CMOS technologies, FinFET or FDSOI platforms, SRAM, non-volatile memory, RF, analog, or power devices.
Knowledge of automotive reliability standards, including AEC-Q100.
Experience with Process Reliability Monitoring, reliability model development, semiconductor qualification methodologies, or customer-facing technical reviews.
Experience using JMP, Python, MATLAB, Excel, or equivalent tools for reliability data analysis and visualization.

Responsibilities

Support reliability qualification planning and execution for advanced semiconductor technologies.
Analyze reliability mechanisms including Hot Carrier Injection (HCI), Bias Temperature Instability (BTI), Time-Dependent Dielectric Breakdown (TDDB), dielectric breakdown, SRAM reliability, non-volatile memory reliability, and power-device reliability.
Develop and review reliability models, lifetime extrapolations, and statistical analyses that support technology and product qualification decisions.
Support definition and continuous improvement of Process Reliability Monitoring strategies, methodologies, and data-analysis workflows.
Collaborate with Reliability, Device Engineering, Process Integration, Product Engineering, Test, Manufacturing, and Failure Analysis teams to investigate issues and drive technical actions to closure.
Perform technical risk assessments and prepare data-driven recommendations for qualification readiness and product-release reviews.
Prepare qualification reports, reliability reviews, technical documentation, and presentations for internal and customer-facing discussions.
Develop or improve analytics, automation, and monitoring tools using JMP, Python, MATLAB, Excel, or equivalent platforms.
Participate in continuous-improvement initiatives that strengthen qualification methodologies, reliability data quality, and engineering decision-making.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.