Chip Lead

NXP Semiconductors•Austin, TX

6d•Hybrid

About The Position

The AI & Chip Engineering team defines and develops System on Chip, ASIC’s, Digital and Analog IP’s for a wide range of products, including Automotive microprocessors, Application processors, Data Center and network processors. This role involves leading product execution for Automotive ASIL-B/D SoC’s & Data Center SOCs. The Chip Lead will work with Systems, Marketing, PE/TE and Arch engineering to define the part, generate and analyze data for architecture decisions, and collaborate with IP, Technology, and packaging partners. The role requires overseeing definition management, ensuring implementation compliance, and working closely with downstream teams, Test and Product Engineering, and post-silicon evaluation teams to address design issues and enable productization. The Chip Lead will also work with the Program Management Office to articulate dependencies and manage projects, assess workload, and mentor engineers across various functions. Key challenges include the implementation of safety mechanisms in Automotive SoC development, ensuring high quality and reliability, and leading teams in a matrix organization. The role demands understanding the impact of architecture on realizability, working within constraints, and acting as the central design point of contact for all associated cross-functional teams.

Requirements

Bachelors in Engineering with at least 15 years of design development experience
At least 5 years of leading complete design and design functions
Experience in leading Global cross functional teams
Experience in leading designs in smaller geometries desired

Nice To Haves

MS in Electrical Engineering preferred
Higher level education may substitute for some experience

Responsibilities

Lead product execution for Automotive ASIL-B/D SoC’s & Data Center SOCs
Work with Systems, Marketing, PE/TE and Arch engineering to define the part
Generate and analyze data to take right and cost effective architecture decision
Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part
Work with IP and SoC functions (frontend, verification, AMS, DFT, Emulation, Validation, Physical implementation) to understand and resolve inter/intra functional handoff and challenges
Oversee definition management and make sure the implementation complies with the requirements
Work closely with downstream teams dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed
Work closely with Test and Product engineering teams to enable productization
Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues
Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects
Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements
Mentor engineers across various functions