About The Position
Micron Technology is a global leader in memory and storage innovation. As a Central Product Integration Engineer, you will provide technical leadership across Micron’s global network to drive yield, product quality, and successful New Product Introduction (NPI). Working at the intersection of Test, Product, Yield, Front-End Manufacturing, and Packaging/BEOL integration, you will collaborate across functions and translate complex technical challenges into scalable, network-wide solutions. You will work with teams in the U.S., Japan, Taiwan, and Singapore to meet performance, quality, and reliability targets. The role focuses on improving yield, quality, and benchmark performance; coordinating cross-site project data and execution; delivering yield improvements through an end-to-end understanding of product design, test flow, packaging interaction, and manufacturing; and preparing packaging technology and chip-package interaction for product qualification. You will lead global task forces, develop and deploy best-known methods and business processes, communicate technical status and proposals, and travel to Micron fab and development sites as needed.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
- At least 4 years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
- Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
- Demonstrated ability in data analysis, debugging, and technical problem solving.
- Strong written and verbal communication skills.
- Ability to work independently in a cross-functional, global environment and manage multiple priorities.
- Ability to travel 20–50%.
Nice To Haves
- Experience with DRAM High Bandwidth Memory (HBM) products.
- Exposure to advanced DRAM technologies such as HPM, advanced packaging, chip-package interaction, BEOL integration, or layout topics.
- Experience collaborating across Product, Test, Yield, Design, Packaging, and Manufacturing teams.
- Demonstrated ability to drive alignment and execution in central or network-level roles.
- Strong interest in innovation, continuous improvement, and scalable solution development.
- Experience and/or interest in developing Agentic AI workflows into current or future processes.
Responsibilities
- Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products.
- Integrate cross-site project data involving design, test, yield, and manufacturing, and drive execution through closure.
- Deliver yield improvements using an end-to-end understanding of product design, test flow, packaging interaction, and manufacturing while balancing reliability requirements.
- Define and execute strategies to ensure Packaging Technology and Chip-Package Interaction readiness ahead of product qualification.
- Lead cross-functional global task forces to resolve yield and quality issues efficiently.
- Develop, standardize, and deploy best-known methods (BKMs) and business processes to improve productivity.
- Communicate status, risks, and technical proposals clearly and partner with leadership to drive results.
- Travel to Micron fab and development sites as needed to support execution and alignment.
Benefits
- Choice of medical, dental, and vision plans.
- Income-protection benefit programs for illness or injury.
- Paid family leave.
- Paid time-off program.
- Paid holidays.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
