Camera Module Design Lead

Apple

1d

About The Position

As part of Apple’s Camera Technologies group, the Camera Module Design Lead helps design and develop camera technology for Apple products, contributing to photography experiences through work spanning sensor to lens. The role takes ownership of the development and system integration of high-performance, compact camera modules and depth-sensing hardware, including RGB camera and depth-sensing optics, sensors, actuators, and packaging. It collaborates with optical, electrical, process, controls systems, sensing, test, and mechanical teams, and leads offshore manufacturing partners through design evaluation, prototype builds, and qualification. The role also evaluates and debugs camera and depth-sensing hardware at module and product levels, leads failure analysis and corrective actions, analyzes manufacturing and reliability data, and documents camera-specific design, test, and manufacturing requirements. International travel to supplier facilities may be required for product development and production bring-up.

Requirements

• BSc, MSc, or PhD in a relevant field such as Electrical Engineering, Mechanical Engineering, Optics, Physics, Materials, or equivalent.
• Ability to lead a multifunctional team of engineers and scientists through R&D and product development from concept to mass production.
• Ability to influence cross-functional teams, manage risk, make decisions with limited information, and deliver on a fast-paced development schedule.
• Ability to communicate and convey ideas clearly and concisely.
• Familiarity with at least three of the following: camera module or imaging system design and architecture, including optical components, optical sensing, and system integration; design and tolerance analysis of highly constrained, high-volume actuators or translational mechanisms; electronic circuit and system design, including power delivery, high-speed signal integrity, and electrical integration of sensor interfaces; geometric optics and image-quality evaluation, including test charts, algorithms, and lighting; image/depth sensor design or characterization; compact module manufacturing processes such as sensor attachment, flex attachment, and active alignment; failure analysis techniques such as optical microscopy, X-ray, CT scans, and SEM; root-cause and corrective-action analysis; statistical analysis, data reporting, and visualization.
• Proven track record of delivering new products into mass production on time while meeting yield and efficiency targets.

Nice To Haves

• For BSc candidates, 3+ years of work experience in optomechanical products or semiconductors is preferred.

Responsibilities

• Own development and system integration of high-performance, compact camera modules and depth-sensing hardware.
• Define and conduct trade-off studies for RGB camera and depth-sensing optics, sensors, actuators, and packaging.
• Work with optical, electrical, process, controls systems, sensing, test, and mechanical teams to integrate camera and depth-sensing hardware into products.
• Lead offshore manufacturing partners in camera and depth-sensing design evaluation, product prototype builds, and qualification.
• Lead failure analysis and corrective-action implementation at manufacturing sites and remotely, including review of assembly processes, testing, calibration, end-of-line yield data, and post-reliability failures.
• Evaluate and debug camera and depth-sensing hardware at module and product levels for camera design and integration.
• Document camera-specific design, test, and manufacturing requirements.
• Lead a multifunctional team through product development from concept to mass production.
• Travel internationally to supplier facilities for product development and production bring-up, if required.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior