C2C Bonding Engineer

Samsung Electronics•Austin, TX

1d•$131,000 - $206,000•Onsite

About The Position

Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow. Come innovate with us! In your role as a Copper-to-Copper (C2C) Bonding Expert, you'll be responsible to lead the development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CMOS Image Sensors (CIS). You'll use your expertise to drive innovations in hybrid bonding processes enabling stacked image sensors with superior yield, performance and reliability.

Requirements

Bachelor’s Degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field
5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience is required.
Expert understanding of overall process flow in assigned areas - Demonstrated understanding of the interactions between process and yield, product performance and reliability.

Nice To Haves

10+ years of experience in Process/Module Integration highly preferred.
Prior knowledge in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) highly preferred.

Responsibilities

Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.
Own all Systematic Yield/Reliability related issues for these steps.
Lead projects to cure these systematics from the technology and/or improve detection for them.
Own critical dimension targeting and variation control within the Module.
Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.