Bond and Grind Process Technician

Wolfspeed • Marcy, NY

47d • $19 - $27 • Onsite

About The Position

This position provides process sustaining support in an automated semiconductor production environment. Area of concentration could be any of the following: Photolithography, Wet Processing, Etch, Thin Films, Diffusion, Implantation, Metrology, and/or Bond & Grind. This position will work a 12-hour day shift with a "3on-4off-4on-3off" alternating schedule. This posting is for a Front End Night schedule and working every other Saturday and working every Sunday/Monday/Tuesday night.

Requirements

• Associate degree in Electronics Engineer Technology (EET) or Mechanical Engineering Technology (MET). Will also consider a degree in a relevant technical field or equivalent experience within a semiconductor environment.
• Understanding of and ability to handle structured problem solving 5Y and 8Ds
• MS Word, MS Excel, and MS Access experience.
• Strong written and oral communication skills.
• Strong mechanical and electrical aptitude.

Responsibilities

• Work closely with Engineering team to develop and qualify new processes and new tool sets. This will include characterizing, documenting and possibly presenting data based around design of experiments (DOE).
• Report and document process issues and equipment malfunctions. Take corrective action and interact with Process Engineers & Equipment Maintenance to identify and resolve non-conformance process and equipment operations.
• Handle material depositions and work to resolve any lot issues that may arise.
• Assist in creating new procedures and refining existing ones, and assist in maintaining reticle inventory system.
• Work collaboratively to achieve quarterly set yield and cycle time goals.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Associate degree