Associate, Electrical Engineering (Rochester, NY)

L3Harris Technologies•Town of Gates, NY

7d•$62,000 - $115,000

About The Position

The Associate Electrical Engineer prepares component drawings and specifications for complex electro-optical, opto-mechanical, or electro-mechanical products. The role supports engineering and purchasing with procurement and parts selection, prepares nonstandard part and material submittals, and works with internal and external laboratories to interpret test results and define testing that verifies compliance with requirements. The engineer communicates technical issues and work status to program engineers, management, and customers; presents analysis results; provides technical consultation in areas of expertise; and reviews component and material quality documentation for conformance. Work follows established procedures and detailed instructions or guidance from senior functional staff. Depending on the engineering area, responsibilities may include digital and FPGA design, RF/microwave testing and circuit design, optical communications and RF photonics, antenna design and evaluation, hardware design verification, or optical design, analysis, metrology, and integration support. The position may also involve system feasibility analysis, modeling and simulation, experimental testing, component selection, design reviews, and support for optical technologies and business opportunities. The schedule is 9/80: employees work nine days in each 14-day period, totaling 80 hours, and have every other Friday off. Eligible applicants must be pursuing a relevant bachelor's degree or have completed one within the past 12 months.

Requirements

Must be pursuing a bachelor's degree in Electrical Engineering, Computer Engineering, Electrical & Computer Engineering, Materials Engineering, Materials Science Engineering, or a related field, or have completed a bachelor's degree within the last 12 months.
For digital design work, knowledge of programmable logic, VHDL, and digital communications systems is specified.
For modem design work, knowledge of digital communications systems, waveform generation, signal processing, FPGA design in VHDL, and familiarity with digital signal processor chips is specified.
For DSP design work, knowledge of digital signal processing techniques, algorithm development, software coding, and simulation or modeling using MATLAB is specified.
For microelectronics design work, training in advanced electronics packaging and MEMS technology is specified.
For RF/microwave work, familiarity with common commercial RF design and analysis tools is specified.
For antenna engineering work, ability to use design tools such as HFSS, CST, MATLAB, and GRASP is specified.
For hardware verification work, familiarity with tools such as network analyzers and LabVIEW is specified.

Nice To Haves

Experience with high-density interconnect and semiconductor packaging technology.
Knowledge and/or experience with VHDL, MCM, HFSS, network, power, analog, antennas, controls, ENE, RF, photonics, modem, EDA, DSP, MATLAB, communication systems, FPGA, the aerospace industry, or optical engineering.
Knowledge of Code V and/or Zemax software tools.
Excellent communication, technical writing, and presentation skills.
Knowledge of FRED, MATLAB, and Python.
Knowledge of or understanding of circuit analysis and operational concepts.
Familiarity with LINUX and Windows computing environments.

Responsibilities

Prepare component drawings and specifications for complex electro-optical, opto-mechanical, or electro-mechanical products.
Support engineering and purchasing with procurement and selection of parts and materials; prepare nonstandard part and material submittals.
Coordinate with internal and external laboratories to interpret test results and define testing to confirm parts meet requirements.
Communicate technical issues and work status to program engineers, management, and customers.
Present analysis results to program engineers and customers to support accurate interpretation and understanding.
Provide technical consultation in areas of expertise and review material and component quality documentation, including supplier data and test results, for conformance to requirements.
Follow established procedures and detailed instructions or guidance from senior functional staff.
For digital engineering assignments, design, analyze, modify, test, and evaluate FPGA and programmable hardware; design complex circuit card assemblies; conduct system analysis, simulation, design reviews, and experimental testing; select components and equipment; and write scripts to control synthesis and build tools.
For RF engineering assignments, test and evaluate RF/microwave devices, including S-parameter, large-signal load-pull, and modulated-signal measurements; design and analyze RF circuits and systems; and conduct feasibility analysis and experimental testing.
For photonics assignments, design, analyze, modify, test, and evaluate optical communications systems and subsystem components, including RF photonic systems.
For antenna engineering assignments, design, analyze, modify, test, and evaluate antenna systems and subsystem components; evaluate antennas in anechoic chambers and use network analyzers.
For hardware design verification assignments, design and modify tests to verify product and accessory operating states; test, analyze, and evaluate hardware requirements compliance.
For optical engineering assignments, perform optical design and analysis; develop optical budgets and sensitivities; verify compliance with optical requirements; perform tolerancing analyses; and provide modeling, analysis, and metrology support during system alignment, integration, and testing.
Support development of optical technologies and architectural concepts for current and future business opportunities.