ASIC Package Design Manager
About The Position
Broadcom is seeking an experienced IC Package Design Manager to lead a team of engineers designing complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support and develop the engineering team, as well as contribute to technical methodologies and project management.
Requirements
- BSEE/MSEE or similar field and 12+ years of experience in flip-chip-BGA package design, including high-speed SerDes, with a minimum of 3 years in management
- Knowledge of package-level signal integrity and power integrity, to apply to package designs
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
- Self-management and organization skills
- Technical understanding related to package design: Package-Design lifecycle
- How the substrate and package fit into the overall ASIC design and manufacturing flows
- Design Data, including how it is created and used: .mcm, package spreadsheet, drawings (POD, Lid, Substrate)
- DFx trade offs (Design for “x”, where is x is manufacturability, reliability, assurance of supply, SI/PI, etc)
- Layout SI/PI extractions and Simulations
- Automation code development
- Mechanical & Thermal modeling
- Project Management
- New Business Quotes
Nice To Haves
- Previous experience managing people and projects
Responsibilities
- Understand the skill sets and traits of each team member, in order to maximize productivity and retention
- Project Management : Create and track project plans for 20+ concurrent designs (scope, schedules, resources)
- Organize team & customer activities to keep projects on track
- Communicate plans, status, next steps and risks
- Create technical methodologies for package design
- Steering package technology and design rules, with input from team members
- Customer, vendor, & cross-functional collaboration
Benefits
- Discretionary annual bonus
- Competitive new hire equity grant
- Annual equity awards
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company paid holidays
- Paid sick leave
- Vacation time
- Paid Family Leave
- Other leaves of absence
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What This Job Offers
Job Type
Full-time
Career Level
Manager
