APTM NPI Integrator

Intel•Aloha, OR

4d•Hybrid

About The Position

Intel is seeking an experienced APTM NPI (New Product Introduction) Integrator to lead technology transfer, manufacturing readiness, quality improvement, and yield optimization for advanced packaging and technology development programs. The role drives new technologies into manufacturing by defining roadmaps, establishing operational strategies, and ensuring product and process readiness from startup through high-volume manufacturing (HVM). It combines manufacturing expertise, data analytics, and cross-functional influence to accelerate technology deployment and improve manufacturing performance. The Integrator leads the development and execution of new product and process introductions and transfers across factories. The role coordinates the logistical introduction of products into factories, provides process documentation to factory customers, and serves as a primary information interface between the fab and upstream and downstream customers. Responsibilities also include tracking collateral, communicating wafer shipments to post-fab customers, maintaining product codes, setting up lot flows, initiating module NPI checklists, and monitoring silicon through setup, power-on, engineering samples, and first production. The Integrator develops NPI systems and business processes, addresses issues identified through NPI reflections, uses data analytics to support process improvement and troubleshooting, and leads cross-functional teams using model-based problem-solving methods. Regular onsite presence is required for essential responsibilities, though the role is eligible for Intel’s hybrid work model. This is an experienced-hire position based in Hillsboro, Oregon. The position is not eligible for Intel immigration sponsorship.

Requirements

Bachelor’s degree in Chemistry, Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field, plus at least 2 years of relevant experience; or a master’s degree in one of these fields plus at least 1 year of relevant experience.
Experience combining engineering fundamentals and manufacturing workflows.
Experience extracting and analyzing data using SQL and/or Python.
Strong understanding of product lifecycle, fab processing, and post-fab activities.
Good understanding of key product and process development milestones.
Strong experience working with and managing NPI builds in a factory environment.
Ability to learn quickly and apply new concepts to solve complex problems.
Ability to be onsite regularly to fulfill essential job responsibilities.

Nice To Haves

Experience in more than one process module in a WLA, Die Prep, Sort, or Fab environment.
Familiarity with manufacturing systems such as MES300 and process flow route creation.
Knowledge of process improvement methodologies, including Intel’s Change Control Process and Model-Based Problem Solving (MBPS).
Experience with NPI project management and startup of new technologies.
Experience integrating packaging processes with overall product manufacturing workflows.
Experience designing packaging solutions that meet product specifications, regulatory requirements, and customer needs.
Previous related work experience in a semiconductor foundry.

Responsibilities

Coordinate the logistical introduction of new products into the factory and provide required process documentation to factory customers.
Serve as the primary information interface between the fab and upstream and downstream customers.
Track collateral items, communicate wafer shipments to post-fab customers, and create and update product codes in internal systems.
Set up lot flows and initiate NPI checklists for each module.
Start silicon and monitor its progress through the process flow from setup and power-on through engineering samples and first production.
Develop and implement NPI systems and business processes, and close issues identified in NPI reflections.
Use data analytics tools such as SQL and Python to synthesize insights from structured and unstructured data for process improvement and troubleshooting.
Lead cross-functional teams through model-based problem-solving to address process excursions and improve operational efficiency.
Lead technology transfer, manufacturing readiness, quality improvement, and yield optimization for advanced packaging and technology development programs.
Define roadmaps and operational strategies and ensure product and process readiness from startup through high-volume manufacturing.
Drive capacity execution efficiency.