Application Engineering Director

Diamond Foundry • Bay Area, CA

1d

About The Position

Diamond Foundry Inc. is seeking an experienced Director of Application Engineering to lead integration of its single-crystal diamond into semiconductor devices, with a focus on advanced bonding and packaging. The role leads the application engineering function and sets the technical direction for bonding diamond to customer devices for advanced packaging and thermal management applications. It owns bonding technology strategy and turns that strategy into customer programs, roadmaps, and paths to production.

The director leads process development and validation and serves as senior technical lead for customer programs from prototyping through qualification, technology transfer, and scale-up to mass production. The role also partners with executive leadership, R&D, product, and business development on roadmaps, resourcing, and new opportunities, and presents technical strategy, results, risks, and tradeoffs to customers, executives, and industry partners. The position combines hands-on laboratory expertise with team leadership and executive-level communication.

Requirements

• Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field.
• 10+ years of experience in semiconductor packaging, process engineering, or thermal management, including 3+ years leading engineering teams or programs.
• Deep, hands-on expertise in wafer/die bonding technologies and related processes, including surface preparation, thin-film metallization, metrology, failure analysis, and reliability testing.
• Strong understanding of advanced packaging architectures, including 2.5D/3D IC, CoWoS, flip-chip, and fan-out, and their thermal management challenges.
• Proven record of taking bonding or packaging processes from R&D through qualification and into high-volume manufacturing, including technology transfer to customers or OSATs.
• Excellent communication and executive presence, with the ability to translate complex technical issues into clear business decisions for management and customers.

Nice To Haves

• Master’s or PhD degree.
• Experience with high-thermal-conductivity materials such as diamond or SiC.

Responsibilities

• Lead and grow the application engineering function, setting technical direction for bonding single-crystal diamond to customer devices in advanced packaging and thermal management applications.
• Own bonding technology strategy, including evaluation, selection, and optimization of pressure and pressureless sintering, thermocompression, surface/plasma-activated, hybrid, and emerging bonding methods across device designs and material stacks.
• Direct process development and validation, including surface preparation, metallization, DOE-based optimization, characterization, failure analysis, and reliability testing.
• Serve as the senior technical lead on customer programs from prototyping through qualification, technology transfer, and scale-up to mass production.
• Partner with executive leadership, R&D, product, and business development on product roadmaps, resourcing, and new application opportunities, with clear reporting on schedules, technical risks, and results.
• Present technical results and strategy to customers, executives, and industry partners.

Benefits

• Company shares; the position is eligible for company shares.
• Eligible employees may enroll in benefit programs generally including health insurance, flexible spending accounts, retirement savings plans, life insurance, and disability insurance.
• Programs providing paid and unpaid time away from work.
• Employee discounts to VRAI.
• Benefits begin as early as the first day of employment. Medical and vision coverage are retroactive to the start date; dental and voluntary benefits take effect after enrollment is completed.

What This Job Offers

• Job Type: Full-time
• Career Level: Director