Application Engineering Director
About The Position
Diamond Foundry is seeking an experienced Director of Application Engineering to lead the integration of single-crystal diamond into semiconductor devices, with a focus on advanced bonding and packaging. The role leads the application engineering team supporting semiconductor and AI chip customers seeking improved thermal performance. It owns the technical bonding strategy and translates it into customer programs, roadmaps, and paths to production. The role combines hands-on laboratory work and technical leadership, including presenting strategy, risks, and tradeoffs to executive leadership and customers. The director will guide processes from early prototypes through qualification and high-volume manufacturing, and build a team capable of doing the same.
Requirements
- Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field.
- 10+ years of experience in semiconductor packaging, process engineering, or thermal management, including 3+ years leading engineering teams or programs.
- Deep, hands-on expertise in wafer/die bonding technologies and related processes, including surface preparation, thin-film metallization, metrology, failure analysis, and reliability testing.
- Strong understanding of advanced packaging architectures, including 2.5D/3D IC, CoWoS, flip-chip, and fan-out, and their thermal management challenges.
- Proven record of taking bonding or packaging processes from R&D through qualification and into high-volume manufacturing, including technology transfer to customers or OSATs.
- Excellent communication and executive presence, with the ability to translate complex technical issues into clear business decisions for management and customers.
Nice To Haves
- Master’s or PhD degree.
- Experience with high-thermal-conductivity materials such as diamond, SiC, or similar.
Responsibilities
- Lead and grow the application engineering function, setting technical direction for bonding single-crystal diamond to customer devices in advanced packaging and thermal management applications.
- Own the bonding technology strategy, including evaluating, selecting, and optimizing pressure and pressureless sintering, thermocompression, surface/plasma-activated, hybrid, and emerging bonding methods across device designs and material stacks.
- Direct process development and validation, including surface preparation, metallization, DOE-based optimization, characterization, failure analysis, and reliability testing.
- Serve as the senior technical lead on customer programs, from prototyping through qualification, technology transfer, and scale-up to mass production.
- Partner with executive leadership, R&D, product, and business development on product roadmaps, resourcing, and new application opportunities, reporting on schedules, technical risks, and results.
- Present technical results and strategy to customers, executives, and industry partners.
Benefits
- Eligible employees may enroll in health insurance, flexible spending accounts, retirement savings plans, life insurance, and disability insurance programs.
- Paid and unpaid time away from work programs.
- Employee discounts to VRAI.
- Benefits begin as early as the first day of employment; medical and vision coverage are retroactive to the start date, while dental and voluntary benefits take effect after enrollment.
- The position is eligible for company shares.
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What This Job Offers
Job Type
Full-time
Career Level
Director
