The candidate will be an individual with demonstrated expertise, preferably in two or more of the following areas: Optical thin film metrology including scatterometry, UV-visible and IR techniques; X-ray based metrology including XRF, XPS, HR-XRD; elemental analysis using SIMS; electrical film metrology including both contact and non-contact techniques; optical defect inspection including unpatterned wafer inspection and edge inspection; contamination analysis using TXRF-VPD and VPD-ICPMS; Nanomechanical techniques using nano-indentation and profilometry using AFM; Photoacoustic techniques. The candidate will have several years of work experience on metrology applications with multiple techniques. The candidate will work primarily with process teams across Applied and develop metrology applications to support product and process development. He/she will also implement metrology best practices and provide data analysis for projects. The successful candidate will also be willing to learn application of new metrology techniques. The role will involve supporting Applied teams worldwide; travel will be limited and expected to be less than 10%.
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Job Type
Full-time
Career Level
Senior