Aerospace Module Product & Reliability Engineering Intern

MACOM•Northampton, MA

23h•Onsite

About The Position

MACOM is a global leader in advanced semiconductor products for Data Centers, Telecommunications, Industrial, and Aerospace and Defense markets. We develop innovative technologies in RF, microwave, millimeter wave, photonics, and high-speed analog. Our solutions support critical network infrastructure for AI, high-performance computing, satellite communications, radar, UAVs, medical equipment, test and measurement, and advanced wireless networks. With over 75 years of expertise, we are committed to customer success by solving their most challenging problems with leading-edge semiconductor solutions. This is a summer internship position with the mmWave module design team at MACOM’s Western Massachusetts design center. The candidate will be designing and/or conducting reliability studies to qualify new materials for use in space applications. As an intern, you will receive mentorship and guidance from experienced engineers, with a commitment to your professional growth and a rewarding, challenging experience.

Requirements

Pursuing a Bachelor's or Master's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Manufacturing Engineering, Aerospace Engineering, or a related technical discipline.
Experience with 3D CAD modeling and mechanical design, preferably using SolidWorks
Familiarity with aerospace qualification requirements
Familiarity with material outgassing
Understanding of engineering drawings, GD&T, and tolerance analysis
Familiarity with manufacturing processes including machining, assembly, and fixture design.
Ability and willingness to create detailed technical documentation, drawings, test plans, and design packages
Strong problem-solving skills and ability to work independently on technical projects
Effective communication skills and ability to collaborate across multidisciplinary engineering teams
Ability to collaborate with other engineering interns and cross-functional teams to develop and test qualification hardware
Interest in hardware development and qualifications
Self-motivated, organized, and capable of managing multiple design tasks simultaneously
Comfortable working in a fast-paced environment where project priorities may evolve
Interest in aerospace, defense, high-reliability electronics, and advanced packaging technologies

Nice To Haves

Exposure to electronic packaging, microelectronics, RF/microwave hardware, or aerospace electronics
Knowledge of soldering processes, solder joint reliability, and qualification testing techniques.
Experience working with materials such as epoxies, elastomers, ceramics, alumina substrates, or thermal interface materials
Understanding of tolerance stack-up analysis and connector alignment considerations.
Exposure to reliability, environmental, or qualification testing in aerospace, defense, or high-reliability applications
Basic understanding of wire bonding, microelectronic assembly, or substrate-level packaging techniques
Experience supporting laboratory testing, data collection, and technical report generation