Advanced Process Development Engineer

PENTAGON TECHNOLOGIES GROUP INC•Hayward, CA

1d•$135,000 - $157,000•Onsite

About The Position

Pentagon Technologies is seeking an Advanced Process Development Engineer to develop, qualify, and industrialize next-generation precision cleaning, surface treatment, coating, and contamination-control solutions for semiconductor manufacturing equipment. This engineer will primarily connect customer wafer-fab requirements with Pentagon's laboratory and production capabilities - translating process-tool challenges, chamber-part failure modes, and advanced-node contamination risks into robust, scalable service processes. The ideal candidate brings direct experience inside a leading semiconductor manufacturer such as Intel, TSMC, Micron, Samsung, GlobalFoundries, or Texas Instruments, or equivalent customer-facing experience with an equipment OEM such as Applied Materials or Lam Research. The role requires the technical depth to engage process, equipment, yield, and supplier-quality engineers and the execution discipline to move concepts from experiment through customer qualification and multi-site production release. SUCCESS IN THIS ROLE: Qualified new processes that solve real customer problems, improve chamber performance and part life, lead Pentagon’s continuous improvement projects and can be reproduced safely and profitably across Pentagon sites.

Requirements

Bachelor's degree in Chemical Engineering, Materials Science, Chemistry, Mechanical Engineering, Physics, or a closely related technical field.
Five or more years of relevant engineering experience in semiconductor wafer fabrication, semiconductor equipment, precision cleaning/coating, advanced materials, or another high-purity manufacturing environment.
Strong process integration mindset with broad knowledge of semiconductor manufacturing processes and their interdependencies.
Understanding of how chamber conditions and replaceable chamber components impact process performance across etch, deposition, lithography, implant, CMP, wet clean, and other fab modules.
Demonstrated experience designing experiments, analyzing data, solving ambiguous technical problems, and converting results into controlled manufacturing processes.
Experience with contamination control, cleanroom protocols, statistical process control, FMEA, root-cause analysis, and formal change control.
Ability to communicate credibly with customers, write clear technical reports, and lead cross-functional work without relying on direct authority.
Ability to work safely around industrial equipment and regulated chemicals and to travel to customer and Pentagon facilities.

Responsibilities

Own development programs for precision cleaning, chemical stripping, surface preparation, texturing, passivation, coating, and contamination-control processes used on semiconductor tool chamber components.
Translate customer process conditions - including deposition and etch films, plasma exposure, temperature, chemistry, RF environment, and chamber matching requirements - into part-level cleaning and coating specifications.
Lead structured experimentation using DOE, statistical analysis, and sound materials characterization to establish process windows, critical parameters, acceptance criteria, and control plans.
Develop customer qualification plans and technical packages, including baseline characterization, coupons or part trials, risk assessment, data analysis, deviation management, and final qualification reports.
Serve as a technical interface with fab process, equipment, yield, contamination-control, and supplier-quality teams; participate in technical reviews, excursions, and root-cause investigations.
Evaluate component failure mechanisms such as corrosion, erosion, particle generation, coating delamination, dimensional change, residue retention, and cross-contamination; recommend solutions based on evidence.
Partner with Operations to transfer laboratory processes into production using PFMEA, control plans, work instructions, SPC, measurement-system analysis, training, and release criteria
Lead CAPA, 8D, and failure-analysis activity for complex customer or process issues; communicate conclusions and corrective actions clearly to technical and executive audiences.
Develop and validate analytical methods for particles, metals, organics, surface chemistry, morphology, thickness, adhesion, roughness, and cleanliness as applicable.
Support new equipment selection, specification, installation, process acceptance, and ramp; ensure EHS, chemical compatibility, waste, and permitting requirements are addressed early.
Build technology roadmaps by monitoring advanced-node process changes, new chamber materials and coatings, OEM platform evolution, and unmet customer needs.
Protect Pentagon intellectual property through disciplined documentation, invention disclosures, confidentiality practices, and collaboration with legal and commercial teams.
Provide technical input to quotations, business cases, and customer proposals, including process flow, cycle time, capacity, capital, cost, risk, and anticipated value to the customer.
Standardize successful processes across Pentagon locations while respecting customer-specific copy-exact, change-control, and traceability requirements.