Advanced Packaging Senior Staff Manager

Marvell Technology • Burlington, VT

4d

About The Position

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world, enabling new possibilities across enterprise, cloud and AI, and carrier architectures. Marvell is a place to thrive, learn, and lead for those looking to make their mark on purposeful and enduring innovation. The Marvell Advanced Packaging team is responsible for package design and technology development to meet electrical, mechanical, thermal, and system requirements for next-generation high-performance computing (HPC), Artificial Intelligence (AI), and networking solutions. These designs often involve multi-chip, multiple component configurations like 2.5D and 3D packages, Co-packaged copper or optics, and advanced substrates. Marvell partners with leading manufacturers to solve challenging designs and integrations. As a packaging design manager, you will collaborate with internal business units and support groups to execute package designs, set team priorities, develop staffing plans, and improve team quality and efficiency. You will also interact with end customers and suppliers, and work with leaders and engineers across multiple geographies. This role involves managing the packaging design layout team and assisting the Senior Director with sizing new development projects for high-performance CPU and XPU ASICs, along with other management responsibilities as the organization grows.

Requirements

• 3+ years of people management experience.
• Bachelor’s degree in Electrical Engineering or related fields and 5-10 years of related professional experience or Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience or equivalent professional experience in lieu of a formal degree.
• Excellent leadership, communication, team building and stakeholder management skills.
• Ability to coordinate across multiple projects, manage risks and escalations, and work under tight schedules and budget constraints.
• Outstanding problem solving technical expertise in semiconductor related field.

Responsibilities

• Collaborating with internal business units and support groups to execute package designs that align with schedule and technical requirements.
• Setting priorities for the team and developing staffing plans to support the execution of projects from definition through release to manufacturing.
• Developing standards and tools to improve the quality and efficiency of the team.
• Interacting with end customers and suppliers to negotiate requirements.
• Working with leaders and engineers across multiple geographies and locations.
• Manage the packaging design layout team.
• Help the Senior Director with sizing new development projects for high-performance CPU and XPU ASICs.
• Other management responsibilities as we grow the organization.

Benefits

• Exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments.
• Offerings built around four key pillars: financial well-being, family support, mental and physical health, and recognition.
• An employee stock purchase plan with a 2-year look back.
• Family support programs to help balance work and home life.
• Robust mental health resources to prioritize emotional well-being.
• Recognition and service awards to celebrate contributions and milestones.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Number of Employees: 1,001-5,000 employees