Northrop Grumman’s Microelectronics Center is seeking an Advanced Packaging Program Manager, Level 2, to lead business execution for semiconductor wafer post-processing within the Foundry, Test, and Advanced Packaging Operating Unit. This full-time, on-site position is based in Apopka, Florida, with domestic travel as required by business needs (approximately 10%). The Advanced Packaging team develops, prototypes, matures, and scales microelectronics packaging technologies for defense and commercial customers. The role leads programs throughout their life cycle, from proposal development and startup through execution and contract closeout. The manager develops advanced packaging proposals, introduces new products and processes, and delivers contractual requirements on cost and schedule. Responsibilities include overseeing technical objectives and contractual performance; managing customer and internal interfaces; supporting technology insertion into customer use cases; identifying opportunities for growth and cost reduction; and coordinating with customer technical leaders to understand future technology needs and timelines.
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Job Type
Full-time
Career Level
Manager