Advanced Packaging Principal Integration Technologist

The businesses of Merck KGaA, Darmstadt, Germany•Tempe, AZ

8d•$178,600 - $287,900•Hybrid

About The Position

This role is instrumental in developing EMD Electronics' High Performance Packaging (Advanced Packaging) opportunity definition, ecosystem engagement strategy, and program development. The candidate will drive business and product development from idea to proof of concept for transfer to high volume manufacturing by connecting across key business unit partners and leveraging EMD Electronics' core competencies. The ideal candidate will possess deep equipment, process, and integration knowledge of High Performance Packaging technologies (including Wafer Level Packaging, Hybrid Bonding, Fusion bonding, and adjacent technologies) and a vast ecosystem network (equipment suppliers and IDM/Foundry/Memory customers). The preferred location is Tempe, AZ, but other US locations may be considered. This role does not offer sponsorship for work authorization, and external applicants must be eligible to work in the US.

Requirements

MSc or higher (Mechanical Eng, Electrical Eng, Chem Eng or related engineering fields)
10+ Years 300mm Process/ Equipment R&D hands on experience
Advanced Packaging (300mm) Equipment Tool owner
Advanced Packaging Thin Films Dep/CMP/Bonding or Patterning Process development
Developing integration and process flows
7+ years of collaborative external business developments
SOW (Scope of Work)/ POC (Proof of Concept)/DOE’s on equip/material definition

Nice To Haves

5+ years experience of Adv Pkg Consortia engagements (IMEC, Fraunhofer, CEA Leti, etc) including engagement model definition/ SOW development/ POC execution
Demonstrated ability to work in highly ambiguous environments
Demonstrated ability to work across matrixed organizations and deliver results
Demonstrated ability to influence up to garner resources
Entrepreneurial mindset
Ability to condense complicated material down to key actionable items
Ability to enroll resources to deliver success
Demonstrated knowledge of customer/supplier interactions and how best to ‘mine’ the ‘why’s & how’s’ from those conversations
Self-starter, ability to operate with little direction

Responsibilities

Through technical expertise, identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps.
Through industry/ecosystem connections, continue to acquire in-depth strategic knowledge of customer and OEM roadmaps.
Transfer knowledge/educate peers (both laterally and up) on High Performance Packaging (Advanced Packaging) roadmaps.
Leverage industry knowledge to identify process/equipment/integration challenges.
Work across BUs and CTO office to identify material solutions/developments to solve industry challenges.
Leverage industry network and connections to engage the ecosystem on collaborative development opportunities.
Leverage deep technical knowledge to ensure development programs are identifying and meeting industry standard datasets.
Ensure development programs are leveraging industry expertise to deliver relevant datasets in the timeliest manner.