Advanced Packaging Multi-Physics Modeling Engineer

OpenAI • San Francisco, CA

4d

About The Position

We are seeking a highly motivated engineer to lead multi-physics modeling and simulation for next-generation advanced packaging systems. This role focuses on the co-optimization of thermal, mechanical, and electrical interactions across chip, package, and system levels to enable high-performance AI/HPC advanced packaging solutions. The candidate will collaborate closely with cross-functional engineering teams and external partners to predict and optimize package mechanical, electrical and thermal performance, and system scalability for advanced heterogeneous integration platforms.

Requirements

• Strong experience in thermal and mechanical modeling for advanced packaging systems.
• Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior.
• Experience solving complex chip/package/system integration challenges using multi-physics simulation and first-principles engineering approaches.
• Hands-on experience with finite element analysis (FEA) and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent.
• Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration (EM), and thermo-mechanical interactions.

Nice To Haves

• Enjoy solving extremely challenging thermal, mechanical and electrical challenges for some of the most advanced AI/HPC packaging technology.
• Are motivated by pushing the limits of heterogeneous integration, high-power delivery, advanced cooling, and large-scale packaging architectures.
• Like developing new modeling methodologies and engineering solutions rather than relying only on conventional industry approaches.
• Want to influence real product architecture decisions through simulation-driven insights across chip, package, cooling, and system design.
• Enjoy learning broadly across semiconductor technologies, including chip architecture, power delivery, package integration, materials, cooling, and system-level interactions.
• Strong understanding of electro-thermal interactions and temperature-dependent electrical behavior in high-performance computing applications.
• Familiarity with advanced packaging design including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
• Familiarity with advanced packaging technologies, design flows, materials, and manufacturing processes including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
• MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
• Strong communication, cross-functional collaboration, and technical leadership skills

Responsibilities

• Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems.
• Drive co-optimization of chip, package, and system interactions to improve power integrity, thermal performance, mechanical reliability, and overall package scalability.
• Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures.
• Perform reliability assessment and root-cause analysis for package warpage, stress, underfill interaction, solder fatigue, electromigration, and thermo-mechanical failures.
• Correlate simulation results with silicon, hardware measurements, and reliability test data to improve modeling accuracy and design predictability.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior