Advanced Packaging Integration Engineer

Applied Materials • Santa Clara, CA

3d • $138,000 - $190,000 • Onsite

About The Position

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. Join the Photonics Platform Business Group within the CTO Office at Applied Materials’ Santa Clara headquarters, where you will work with a world‑class research team developing next‑generation silicon photonics packaging technologies. This role focuses on enabling high‑performance optical interconnects and co‑packaged optics through innovative advanced packaging and 3D integration solutions. As an Advanced Packaging Integration Engineer, you will lead process integration for high‑performance interconnects and microLED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while driving differentiated technology development. Success in this role requires close collaboration with fabs, assembly houses, substrate and connector suppliers, and cross‑functional teams across Applied Materials and external partners. You will work closely with design, process, packaging, and metrology teams to deliver production‑ready solutions.

Requirements

• M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM discipline.
• In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
• Candidates with varying experience levels are encouraged to apply.
• Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.
• Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP).
• Self‑starter with strong problem‑solving skills; able to work both independently and in team environments with minimal supervision.

Nice To Haves

• Coding experience is a plus.
• Experience with MES systems is a plus.
• Ability to prepare clear, compelling executive‑level or customer‑facing presentations is a plus.

Responsibilities

• Define, develop, and optimize advanced packaging process integration flows (e.g., 3D heterogeneous integration, die stacking, hybrid bonding) to achieve best‑in‑class performance, yield, and reliability.
• Lead and manage complex technical programs, drive schedules, resolve technical challenges, and ensure on‑time, high‑quality deliverables.
• Design controlled experiments, collect and interpret data, perform root‑cause analysis, and implement corrective actions.
• Collaborate with foundries, OSATs, and Applied Materials research teams to define and implement improved integration methodologies.
• Track industry and competitive advancements and strategically apply new knowledge to drive innovation.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level