Advanced Packaging Engineer – Design & Signal Integrity

Delos Data•Palo Alto, CA

5d•Hybrid

About The Position

We are a stealth-mode startup building foundational technology to address performance, scalability, and resiliency challenges in large-scale AI data center clusters. We are backed by top-tier VC firms and notable angel investors. The company is led by experienced builders and operators who have founded companies, taken them to scale, and exited successfully. We work with a strong sense of unity and shared responsibility, and we expect trust, integrity, and respect in how we collaborate and make decisions. We hold ourselves accountable to one another and to the quality of the work we deliver. Headquartered in Silicon Valley, we operate across a mix of remote and on-site locations in the U.S. and Canada. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.

Requirements

B.S./M.S. in Electrical Engineering or related field.
Strong understanding of EM theory, transmission lines, and signal integrity principles.
Expertise in SI/PI simulation tools (Keysight ADS, Ansys HFSS, Cadence Sigrity/PowerSI).
Experience with high-speed interfaces (UCIe, D2D, Ethernet).
Knowledge of board materials, stack-up design, and constraint management.
Hands-on experience with lab equipment (VNA, TDR, Oscilloscope).
Experience in Multi-Die package designs using standard UCIe (AP and/or SP)
Experience selecting and managing sub-contractors
Experience interfacing with TSMC for packaging options (bumping)

Nice To Haves

Proficiency in programming/automation (Python, Matlab) is a plus.

Responsibilities

Select and design optimal multi-die IC package types considering electrical performance, cost, and manufacturability.
Perform pre- and post-layout simulations (e.g., eye diagrams, crosstalk) for high-speed interfaces (UCIe, D2D, high-speed serdes).
Model and simulate Power Delivery Networks (PDN) for low-voltage, high-current supplies, including AC/DC analysis and IR drop.
Develop accurate simulation models (S-parameters, IBIS-AMI) for packages, PCBs, and sockets.
Work with IC design, physical design, board layout, and marketing teams to define requirements and resolve issues.
Guide PCB/package layout, reviewing stack-ups, trace routing, and component placement for optimal SI/PI performance.
Support hardware bring-up, debug, and correlation between simulation/models and physical measurements.
Research and implement new SI/PI techniques and tools for next-generation products.