Advanced Packaging Design
About The Position
Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer’s most challenging designs and integrations with industry-leading packaging technologies.
Requirements
- Package substrate or PCB layout experience
- Experience with developing solutions with high-speed interfaces such as HBM, DDR, SERDES, PCIe and Die2Die interfaces
- Familiarity with semiconductor packaging technologies, materials, and substrate or PCB design
- Basic knowledge of SI/PI concepts and techniques to optimize signal routing
- Ability to collaborate with engineers in multiple locations and geographies
- Strong communication, presentation and documentation skills
- Proven track record of technical leadership in the organization
- Bachelor's degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with 3+ years of professional experience.
Responsibilities
- Understanding of substrate or PCB design tools such as APD or Xpedition to generate advanced packaging solutions
- Knowledge of floor-planning and architectural considerations surrounding the routing of various interfaces through package substrates and interposers
Benefits
- employee stock purchase plan with a 2-year look back
- family support programs to help balance work and home life
- robust mental health resources to prioritize emotional well-being
- recognition and service awards to celebrate contributions and milestones
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What This Job Offers
Job Type
Full-time
Career Level
Senior
