Cisco Silicon One is seeking an Advanced Packaging Design Engineering Team Leader to lead complex package design programs and the San Jose package design team. The role drives package programs from planning and optimization through execution and tapeout, delivering high-speed, robust, scalable package solutions aligned with system-level requirements and manufacturing needs. The team works on advanced IC package design and heterogeneous system integration, including substrates using 2.5D fanout technologies. The leader will collaborate with layout, signal integrity, power integrity, silicon architecture, and manufacturing partners; provide technical direction and mentorship; coordinate resources across designers, layout editors, and contractors; and develop the team’s package design capabilities. The role also contributes to improved methodologies and development flows, vendor partnerships, cross-functional collaboration, and innovative package solutions for next-generation ASIC platforms. The position requires living within commuting distance of Cisco’s San Jose, California office and commuting there 4–5 days per week.
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Job Type
Full-time
Career Level
Senior