Advanced Packaging Bond Debond Engineer - Sr. Staff

Skywater•Kissimmee, FL

18d•Onsite

About The Position

SkyWater is seeking an experienced Bonding and Debonding Development Engineer for its Florida Advanced Packaging site. The engineer will lead the development and improvement of bonding and debonding process flows to deliver qualified products to foundry clients. The role involves translating client package requests into process flows that may use silicon interposers, FanOut, superconducting materials, hybrid bonding, and permanent or temporary bonding technologies, including thermal, laser, or chemical release. The engineer will identify development needs and process gaps, coordinate module teams and external partners, support integration engineers, and lead task forces when needed to resolve root causes and maintain product deliverables. The position supports process integration for clients and devices spanning MEMS, photonics, high-performance computing, CMOS, memory, AI, and quantum applications, including TSV-first and TSV-last flows. It requires knowledge of tool-set capabilities and process interdependencies, creation of recipes that account for upstream and downstream requirements, and use of metrology and data analysis to characterize processes, investigate defects, and guide decisions. The engineer will monitor SPC trends, improve process performance and yield, incorporate electrical test parametrics, and create rapid learning cycles. The role also includes developing training documents and technical papers and performing other duties as assigned. Strong oral and written communication is required. U.S. citizenship is required because the position requires holding or being able to obtain a government security clearance.

Requirements

Bachelor of Science in Engineering.
At least 7 years of process development and integration engineering experience in an advanced packaging fab environment, including 10K and 1K clean rooms and work related to FanOut wafer-level assembly, quantum, silicon interposer, and hybrid bonding.
Advanced packaging fab processing tools knowledge or experience.
Knowledge of MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration, in a relevant combination with years of experience and/or an advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving capability; data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
Ability to work independently and in cross-functional teams.
Strong oral and written communication skills.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance.

Nice To Haves

Master's or Ph.D.
Project management skills and/or formal project management training.

Responsibilities

Translate client package requests into bond/debond process flows using applicable advanced packaging technologies.
Identify process development needs and lead module teams to deliver qualified products on schedule and with high yield.
Identify process-flow gaps and build external partnerships to enable rapid-turn prototyping.
Lead task forces as needed to identify root causes, correct issues, and maintain product deliverables.
Support integration engineers in meeting new process needs for each project.
Create training documents and write technical papers about state-of-the-art technologies for internal and external audiences.
Develop and use knowledge of tool-set capabilities and process interdependencies to create bonding recipes that account for upstream and downstream requirements.
Integrate processes for clients and devices in MEMS, photonics, HPC, CMOS, memory, AI, and quantum applications.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, identify defect root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify process marginalities and implement improvements.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Use data analysis software to support data-driven decisions.
Create rapid learning cycles to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parametrics to deliver electrically good final packages.
Perform other duties as assigned.