Advanced Packaging Bond Debond Engineer - Sr. Staff

SkyWater Technology Foundry, Inc.•Kissimmee, FL

19d•$114,320 - $171,480•Onsite

About The Position

SkyWater is seeking an experienced Bonding and Debonding Development Engineer for its Florida Advanced Packaging site. The engineer will lead the development and improvement of bonding and debonding process flows to deliver qualified products to foundry clients. The work includes translating client package requirements into flows using technologies such as silicon interposers, FanOut, superconducting materials, and hybrid bonding. Bonding may be permanent, such as fusion or hybrid bonding, or temporary, using thermal, laser, or chemical release technologies. The role spans process development and integration for clients and devices across MEMS, photonics, high-performance computing, CMOS, memory, AI, quantum, and related areas. The engineer will work with integration, process, and tool engineers; characterize processes and defects using metrology; use data analysis to guide decisions; and drive changes that improve device performance, yield, and electrical test results. The position also involves preparing training documents and technical papers, monitoring SPC trends, supporting quick-turn learning cycles, and coordinating task forces or external partnerships when needed. The role requires a bachelor's degree in engineering and at least seven years of relevant process development and integration experience in an advanced packaging fab environment. A master's or Ph.D. is preferred. U.S. citizenship is required because the position requires holding or being able to obtain a government security clearance. The annual salary range is $114,320–$171,480. SkyWater describes its culture as guided by Integrity, Excellence, Collaboration, Empowerment, and Growth Mindset.

Requirements

Bachelor of Science degree in Engineering.
At least 7 years of process development and integration engineering experience in an advanced packaging fab environment, including 10K and 1K clean rooms and experience related to FanOut wafer-level assembly, quantum, silicon interposers, and hybrid bonding.
Knowledge of or experience with advanced packaging fab processing tools.
Knowledge of MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration, supported by a relevant combination of experience and/or advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving ability; data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
Ability to work independently and in cross-functional teams to solve problems.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance.
Strong oral and written communication skills for communicating with foundry customers, colleagues, and management.

Nice To Haves

Master's or Ph.D. degree.
Project management skills and/or formal project management training.

Responsibilities

Translate client package requests into bond/debond process flows, potentially using silicon interposers, FanOut, superconducting materials, and hybrid bonding.
Identify process development needs and lead module teams to deliver qualified products on schedule and with high yield.
Identify process-flow gaps and establish external partnerships to enable rapid-turn prototyping.
Lead task forces as needed to identify root causes, correct issues, and maintain product deliverables.
Support integration engineers in enabling new process needs for each project.
Create training documents and write technical papers on advanced technologies for internal and external audiences.
Use knowledge of tool capabilities and process interdependencies to create temporary and permanent bonding recipes that account for upstream and downstream requirements.
Integrate processes for clients and devices across MEMS, photonics, HPC, CMOS, memory, AI, and quantum applications.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, identify defect root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify process marginalities and implement improvements.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed through integration changes.
Use data analysis software to support data-driven decisions.
Create rapid cycles of learning to identify issues early and develop final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parametrics to deliver electrically good final packages.
Perform other duties as assigned.