Advanced Package Thermal Technologist

Advanced Micro Devices, Inc•Austin, TX

12d•Onsite

About The Position

In this role, you will serve as a Package-centric Thermal Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply thermal models to guide SoC/package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions. The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for package-driven architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.

Requirements

MS or PhD in relevant Engineering disciplines or physics.

Nice To Haves

Demonstrated experience owning and driving model-based architecture & design decisions, supported by SoC, package, and system-level thermal modeling, characterization and validation.
Solid foundation in Thermal and CFD first-principles understanding and multi-physics SoC-package-system-level design & assembly trade-offs.
Strong background in advanced PCB technologies, including materials, designs, and assembly constraints.
Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
Experience influencing SMT processes, connectors, and assembly strategies from an architecture and modeling perspective.
Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.
Track record of influencing experimental test plans and correlating simulation with physical test data (e.g., DOE design, instrumentation selection, or lab collaboration for model validation).
Familiarity with AI/ML-based engineering workflows, such as surrogate/reduced-order modeling, automated optimization pipelines, or ML-assisted anomaly/failure detection applied to physics-based data.

Responsibilities

Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
Develop and maintain thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
Engage with suppliers, partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
Define targets and strategic direction for thermal and package technology development, assess technology readiness, and influence product roadmaps.
Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a primary focus on data center platforms.