Advanced Mfg Engineer Sr Adv

Honeywell Aerospace•Tempe, AZ
•Onsite

About The Position

Advanced Manufacturing Engineering (AME) – New Product Introduction (NPI) links Honeywell’s Integrated Supply Chain with product development functions in Engineering, Program Management, and the Strategic Business Units. AME participates in new product development programs to help meet product cost, capability, and producibility targets by evaluating design, suppliers, product cost, manufacturing facilities, process capability, and manufacturing yield. The role requires knowledge of Honeywell Aerospace processes for Integrated Product Delivery and Support (IPDS), Flawless Launch, and Advanced Product Quality Planning (APQP). This opportunity supports mechanical aerospace component development, including high-voltage controllers, circuit card assembly manufacturing, and production entry. The position requires onsite presence at the Honeywell facility in Tempe, Arizona. Manufacturing and supplier factory-floor exposure is required, including use of safety shoes and glasses.

Requirements

  • Bachelor’s degree from an accredited institution in science, technology, engineering, or mathematics.
  • At least 5 years of Engineering, Program Management, or Integrated Supply Chain experience.
  • Must be a U.S. person: a U.S. citizen, U.S. permanent resident, or a person with protected status in the U.S. under asylum or refugee status.
  • Manufacturing and supplier factory-floor exposure, requiring safety shoes and glasses.

Nice To Haves

  • Product knowledge in circuit card design and assembly, valves, pumps, and actuators.
  • Ability to read engineering mechanical drawings and assess manufacturing capability.
  • Knowledge of circuit card manufacturing using SMT, wave solder, AOI, and in-circuit testing.
  • Experience with conformal coating processes.
  • Advanced computer skills, including Excel, PowerPoint, Word, and MS Project.
  • Excellent oral, written, and presentation communication skills.
  • Advanced understanding of manufacturing techniques and their impact on costs.
  • Project management proficiency and ability to close initiatives on time and within budget.
  • Green Belt, DFSS, Black Belt, Lean, or HOS certification.
  • Demonstrated ability to use Six Sigma tools.
  • Experience with DFMEA, PFMEA, MSA, and other APQP elements.
  • Knowledge of SAP, Teamcenter, and other data system applications.

Responsibilities

  • Conduct Early Supplier Engagement, connecting circuit card assembly design teams with suppliers and capturing feedback.
  • Lead design for manufacturing for circuit card design teams.
  • Lead implementation of new manufacturing techniques.
  • Review conceptual and development designs for cost, quality, manufacturability, and yield.
  • Manage Manufacturing Readiness Level (MRL) items to meet IPDS goals.
  • Manage Unit Product Cost (UPC) models to meet Flawless Launch and APQP goals.
  • Ensure designs benefit from APQP artifacts including PMAP, DFMEA, PFMEA, Control Plan, and PPAP.
  • Ensure products benefit from Flawless Launch artifacts including DFM Scorecard, Heat Map, PRR, and MRA.
  • Work with Engineering and Sourcing to identify suppliers that meet capacity, cost, and capability goals.
  • Identify and manage capital needs for new-product assembly, testing, or tooling.
  • Drive IPDS adherence for all Integrated Supply Chain (ISC)-related items.
  • Manage Cost Take Out (CTO) efforts and risk mitigation plans.
  • Drive design-for-excellence (DFX) activities for manufacturing, assembly, testing, and lean operations.
  • Predict and manage Product Rolled Throughput Yield (RTY) efforts to meet Aerospace RTY goals.
  • Facilitate Production Readiness Reviews and associated Phase 5/C action closures.
  • Work with production cells to ensure smooth production transitions.
  • Provide proposal ISC artifacts in IPDS Phase 2/A as required.
  • Provide AME/ISC scheduling, planning, and budget management to Program Management as required.
  • Understand, manage, and achieve AME HMR hardware delivery program milestones.
  • Drive IPDS adherence for ISC-related items in Phase Exit Criteria Assessment (PECA) check sheets.
  • Achieve ISC program milestones, maintain required IPDS metrics, and provide status presentations.
  • Support AME HOS activities, including standard work definition and tiered MOS accountability.

Benefits

  • Employer-subsidized medical, dental, vision, and life insurance.
  • Short-term and long-term disability coverage.
  • 401(k) match.
  • Flexible spending accounts and health savings accounts.
  • Employee assistance program.
  • Educational assistance.
  • Parental leave.
  • 12 paid holidays.
  • Paid time off for vacation, personal, and sick time.
© 2026 Teal Labs, Inc
Privacy PolicyTerms of Service