Advance Packaging Engineer

Eridu AI•Saratoga, CA

About The Position

We are seeking a highly experienced Advanced Package Engineer to lead system module packaging and advanced single chip Flip Chip IC integration for next-generation high-performance networking and compute platforms. This role owns the end-to-end productization of composite system modules assembly, driving manufacturing readiness and product implementation consisting of organic interposers, organic substrates, cooling solutions, boards, and mechanical hardware. You will architect and deliver complete module packaging assembly solutions. This role also owns leading flip-chip single-die Flip Chip packages and advanced 2.5D integration. You will operate as the technical owner of system module packaging, working hands-on with contract manufacturers, substrate vendors, OSATs, foundry partners, and internal silicon/system teams to translate ambitious architectures into high-volume, production-ready products. This is a highly visible technical leadership role for an engineer who thrives at the intersection of system architecture, packaging design, mechanical modeling, manufacturing, and qualification.

Requirements

BS, or MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
8+ years of experience in system module assembly and advanced IC packaging manufacturing.
Hands-on experience with:
Organic substrates and boards (design, assembly, qualification, production)
SMT assembly, yield management, and rework
Single Chip Flip-chip packaging construction, and materials
Understanding mechanical modeling impacts (warpage, coplanarity, stress. thermal) on construction, materials, and design
Proven track record leading system module packaging assembly with contract manufacturing partners, OSATs, and foundry engagements, which includes as a module, organic interposers, organic substrates, cooling configuration, boards, and mechanical hardware.
Good understanding of high-speed / high-power package constraints.
Experience driving Mechanical Test Vehicles (MTVs), DOE, yield learning builds, and qualification programs.
Demonstrated ability to independently own complex cross-functional deliverables from architecture through prototyping and production.
Experience with system-level module packaging including cooling interfaces, boards, substrates, and mechanical hardware.
Working knowledge of advanced Flip Chip packaging architectures including:
2.5D integration and CoWoS-class interposers
3D packaging and stacked die approaches
Experience with embedded passive component technologies such as capacitors.
Failure analysis leadership across electrical and mechanical domains.
Expertise in System module packaging and single chip packaging qualifications and testing.
Background in high-performance AI accelerators, or networking hardware.
Comfortable operating in fast-moving, dynamic environments with large technical scope.

Responsibilities

System Module Packaging & Manufacturing Lead
Own the full lifecycle of system module packaging assembly integration from architecture through volume production consisting of organic interposers, organic substrates, cooling solutions, boards, and mechanical hardware:
Lead module manufacturing and integration with contract manufacturers and internal engineering teams.
Own system module packaging qualification using Mechanical Test Vehicles (MTVs).
Drive module construction architectures, BOMs, and design approvals.
Drive mechanical modeling activities including warpage, stress, and coplanarity.
Plan and execute module builds, assembly setup, yield learning, and yield data collection.
Lead module qualification, failure analysis, root cause identification, and corrective action closure.
Drive PCB SMT assembly DOE, yield tracking, and continuous improvement initiatives.
Evaluate PCB SMT rework processes using real sample parts and production data.
Define and validate organic substrate rework strategies.
Propose and sign off daisy-chain layouts for organic substrates.
Own regular technical engagement cadence with manufacturing partners.
Establish SMT yield goals, operational metrics, and improvement roadmaps.
Productize module assembly with system integration partners.
Lead module manufacturing readiness reviews and execution.
Drive SMT soldering technology innovation through test vehicles.
Perform manufacturing risk mitigation, and schedule alignment.
Design and support module-level warpage experiments and mitigation strategies.
Organic Substrate and Board Manufacturing Technical Lead
Act as technical owner for organic substrate readiness and embedded component integration:
Drive implementation of embedded component technologies.
Own substrate BOM development and engineering builds.
Define coplanarity plans and acceptance criteria.
Coordinate substrate and board electrical and mechanical design and signoff.
Lead manufacturing, tooling cycle time optimization, yield learning, and qualification strategies.
Monitor product impedance and drive failure analysis on electrical excursions.
Monitor prototype and production yields.
Lead design rule alignment, cost tradeoffs, material selection, electrical and mechanical simulations, and reliability assessments.
Advanced Packaging Architecture Lead
Provide technical leadership across emerging packaging domains:
Lead flip-chip package development:
Coordinate electrical and mechanical modeling of high-power, high-bandwidth organic single chip flip chip packages
Drive assembly integration with OSAT partners
Coordinate substrate layout design
Design package mechanical construction
Contribute to system architecture decisions involving:
2.5D integration
CoWoS-class interposers
3D packaging and stacking approaches
Support CPO packaging floor planning and construction trade studies