ADCE Packaging Design Architect

Intel Corporation•Hillsboro, OR

1d•$220,920 - $311,890•Onsite

About The Position

Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record.

Requirements

Self-motivated engineer who has strong technical background in design and electrical analysis
Solid background in semiconductor fabrication and packaging
Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions
Ability to work independently and at various levels of abstraction
Strong organization, time management, and communication skills, self-motivated
Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx)
10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design

Nice To Haves

Experience and knowledge with assembly process, test and characterization techniques preferred

Responsibilities

Drives end-to-end development for substrate design from concept through tape out
Implements physical layout and routing of the package design
Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs
Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout
Defines substrate design rules
Conducts internal and external reviews
Analyzes data and resolves DRCs to optimize package design
Completes documentation and collateral into the product lifecycle management system of record