Packaging Design Engineer

Google•Sunnyvale, CA

4d•$144,000 - $209,000

About The Position

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. The Packaging Design Engineer serves as the critical technical link between advanced hardware engineering and global operations. In this role, you will lead the end-to-end structural development, mechanical validation, and technical execution of protective packaging systems designed specifically for complex, high-value, and shock-sensitive hardware infrastructure. Operating within a changing New Product Introduction (NPI) framework, you will own the entire packaging development lifecycle from initial concept phase through to global mass production. You will cross-functionally collaborate with product designers, supply chain partners, and manufacturing facilities to translate complex product fragility requirements into highly reliable, scalable, and freight-efficient architectures. You will bring a data-driven approach to structural design, utilizing predictive engineering tools alongside physical testing to eliminate transport risks. You will act as an internal advocate for sustainable engineering, continuously identifying opportunities to reduce carbon footprints, minimize material waste, and optimize cube utilization without ever compromising product safety. Ultimately, your work ensures that our next-generation physical infrastructure transitions seamlessly and reliably from factory floors to global deployment sites around the world. The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide. We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

Requirements

Bachelor's degree in Packaging Engineering, Mechanical Engineering, Industrial Engineering, a related engineering field, or equivalent practical experience.
8 years of experience in hardware product packaging and structural design.

Nice To Haves

8 years of experience in hardware or industrial packaging design.
Proven ability to work autonomously, take complete ownership of projects, and deliver results with minimal guidance.
Natural innovator with a track record of thinking outside-the-box to design creative solutions for complex structural, space, or material constraints.

Responsibilities

Utilize advanced Three-Dimensional/Two-Dimensional Computer-Aided Design software (SolidWorks, Artios CAD, Creo, etc.) to architect complex structural packaging solutions and generate precise technical drawings, assembly instructions, and cushion layouts.
Manage technical documentation within Product Lifecycle Management systems. Own the release of Bills of Materials, component specifications, and Engineering Change Orders/Requests.
Apply strict Design for Manufacturing principles to optimize pack-out workflows, ensuring packaging designs can be assembled efficiently, safely, and seamlessly on global manufacturing lines.
Serve as the Subject Matter Expert on packaging material properties, driving the integration of novel, high-performance, and sustainable or recyclable materials to meet corporate environmental goals.
Conduct Finite Element Analysis and dynamic simulations to evaluate drop impact, velocity, and vibration stress distribution, accelerating development and reducing physical prototyping loops.