3D-IC Application Engineer
About The Position
As an Applications engineer with Siemens EDA Technology Solutions Sales, you will support consultative sales efforts at the world’s leading semiconductor and electronic equipment manufacturers. As an Applications Engineer at Siemens EDA, your primary responsibility is to secure technical design wins for Siemens EDA's product and service offerings. Specifically, you will be responsible for technical wins with the industry leading solutions Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, and other product families. Responsible activities will include delivery of technical presentations, conducting product demonstrations and benchmarks, and participation in development of solutions and account strategies leading to market share gains for Siemens. This position is also expected to help architect and prototype Siemens EDA’s emerging 3DIC solution through the development of flows and integration scripts to link tools into a solution. Your territory coverage consists of Key Accounts located throughout the US. You will be responsible for integrating with peers located all over the world, communicating essential status to a variety of stakeholders and influential customers. International travel may be required.
Requirements
- MSEE/BSEE with 4+ years design experience.
- Significant experience in advanced IC Package layout design and/or interposer layout design.
- Knowledge of IC Package Design (Cadence APD/SiP, Siemens Xpedition/i3DL) is required.
- Practical experience with Package design tools from design setup (stackup/constraints/etc), to implementation (routing/outgassing/re-use/etc), through generation of manufacturing documents is required.
- Above average competency with Microsoft Word, Excel, and PowerPoint.
- Scripting/Programming: VBS, Python, Tcl, Perl, or similar languages.
- Working OS knowledge of Windows and Linux.
Nice To Haves
- Experience with IC design is a plus.
- Familiarity with Package / Interposer planning solutions (Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Excel) is preferred.
- Familiarity with 2.5D and 3D chiplet-based design solutions (TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, etc.) is preferred.
- Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS, etc.) is desired.
- Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS, etc) and analysis flows is preferred.
- Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions is highly desirable.
- Prior experience as an Applications Engineer is preferred.
Responsibilities
- Secure technical design wins for Siemens EDA's product and service offerings.
- Deliver technical presentations.
- Conduct product demonstrations and benchmarks.
- Participate in the development of solutions and account strategies leading to market share gains for Siemens.
- Help architect and prototype Siemens EDA’s emerging 3DIC solution through the development of flows and integration scripts to link tools into a solution.
- Integrate with peers located all over the world.
- Communicate essential status to a variety of stakeholders and influential customers.
Benefits
- Flexibility - Choosing between working at home and the office at other times is the norm.
- Great benefits and rewards.
- Health and wellness benefits.
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
Education Level
Associate degree
