3D IC and ADVANCED PACKAGING CAD ENGINEER

Advanced Micro Devices, Inc•Markham, ON

12d•Hybrid

About The Position

The 3D-IC Design and SoC Construction CAD team delivers automated environments for industry-leading 3D stack generation and validation. Our flows encompass design element creation, port assignment and pattern generation, tile optimization, clock and power distribution, high-performance bus implementation, and timing budgeting. We evaluate, procure, and deploy technologies from leading EDA vendors within a unified flow framework — and increasingly, we embed AI-driven capabilities at every stage of the stack, from silicon to system. This role is part of a global team working in concert with design teams across North America, China, and India. You will collaborate directly with the global CAD organization and project teams to understand design requirements and deliver innovative solutions that combine EDA tools, custom in-house capabilities, and end-to-end AI integration. The ideal candidate brings a strong silicon hardware design background, software and scripting proficiency, and hands-on experience applying machine learning to CAD or EDA workflows.

Requirements

Strong silicon hardware design background
Software and scripting proficiency
Hands-on experience applying machine learning to CAD or EDA workflows
Strong scripting skills in Python, TCL, and Perl in a Linux/Unix environment
Experience with Verilog, RTL, and UPF for multi-clock domain and low power designs
Excellent verbal and written communication skills

Nice To Haves

Strong experience in 3D-IC design and advanced packaging technologies.
Hands-on experience with Synopsys 3DIC Compiler and related EDA toolchains.
Strong understanding of EDA tools from Synopsys and Cadence.
Demonstrated experience applying AI to CAD, EDA, or hardware design problems.
Experience building or working with LLM-based tools, agentic AI frameworks, or AI-assisted automation pipelines.
Familiarity with distributed and cloud compute environments for flow automation.

Responsibilities

Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff.
Develop and integrate end-to-end AI capabilities into CAD flows — including ML-based optimization, predictive modeling, and LLM-assisted automation.
Build and deploy agentic AI systems that automate multi-step design and verification tasks.
Partner with EDA vendors (Synopsys, Cadence) on 3D-IC feature requirements, best practices, and AI co-development opportunities.
Define strategy and key initiatives to ensure flows meet future design requirements and advanced technology nodes.
Regress methodology, analyze results, and develop capabilities that measurably improve quality of results.
Work closely with design and CAD implementation teams to deliver tools and flows meeting key QoR metrics: Timing, Area, and Performance.