3D Heterogeneous Integration Engineer

GlobalFoundries • Malta, NY

23d

About The Position

GlobalFoundries Fab8 is seeking an experienced and dedicated R&D engineer to join the Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives spanning multiple application domains. This role involves driving 3D-HI process development, collaborating with internal teams and external vendors, and managing end-to-end process integration for advanced packaging solutions.

Requirements

• Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• MS degree with at least 5 years of prior related work experience.
• In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
• Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• English (Written & Verbal) language fluency.
• Up to 10% travel.

Nice To Haves

• PhD education level preferred with at least 3 years of prior related work experience.
• Demonstrated prior leadership experience internally or with an OSAT eco-system.
• Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.

Responsibilities

• Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).
• Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
• Collaborate on joint development projects (JDP) with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
• Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
• Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
• Drive data analysis, interpretation of results, and understanding of failure modes.
• Identify and resolve process integration issues and related challenges.
• Generate IP related to novel wafer integration and packaging technology.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Participate in hiring activities.
• Mentor and guide new hires to assume their roles and responsibilities.
• Other duties as assigned by manager.

Benefits

• Full-service semiconductor foundry providing a unique combination of design, development, and fabrication services
• Global manufacturing footprint spanning three continents
• Equal opportunity in the workplace
• Attraction and retention of highly qualified people

What This Job Offers

• Job Type: Full-time
• Career Level: Senior