Weekend Quality Inspector

Analog Devices • Chelmsford, MA

23h • $23 - $32 • Onsite

About The Position

Inspectors work to support RF microelectronics-manufacturing team by performing inspection of highly complex modules. Must have the ability to work on a wide range of commodities including semiconductors, COTs parts, machined housings, printed circuits boards, PCBAs, and discretes. The candidate receives training from their colleagues and engineering staff and must demonstrate attainment of necessary skills to become a Quality Inspector.
The work assignments will include several of the following operations:
Visual Inspections, which shall include but not limited to, precap, final, MMIC and wire bond inspections along with proper Data Entry
Documentation Review
Mechanical Dimensions
Ability to accurately read and interpret prints/Source Control Drawings (SCDs)
Familiarity with the following MIL-STDs and IPC Standards:
Printed Circuit Assembly Solder inspection to IPC-A-610
Low & High-Power Visual Inspection to MIL-STD-883, Method 2010
Hybrid Internal Visual Inspection to MIL-STD-883, Method 2017
Printed Circuit Inspection to IPC-A-600
Package Inspection to MIL-STD-883, Method 2009
Die Shear Testing to MIL-STD-883, Method 2019
Wire bond Testing to MIL-STD-883, Method 2011 and 2023

Requirements

• US CITIZENSHIP
• High School Diploma
• Microelectronics Training/Experience
• Optical Microscopy Inspection
• Bond Pull/Die Shear Gauge
• Go/No-Go gauges
• Ability to work on a wide range of commodities including semiconductors, COTs parts, machined housings, printed circuits boards, PCBAs, and discretes.

Nice To Haves

• SAP ERP systems experience
• EMPOWER Document Control database experience

Responsibilities

• Perform inspection of highly complex modules.
• Perform Visual Inspections (precap, final, MMIC and wire bond inspections).
• Perform proper Data Entry.
• Perform Documentation Review.
• Perform Mechanical Dimensions checks.
• Read and interpret prints/Source Control Drawings (SCDs).
• Perform Printed Circuit Assembly Solder inspection to IPC-A-610.
• Perform Low & High-Power Visual Inspection to MIL-STD-883, Method 2010.
• Perform Hybrid Internal Visual Inspection to MIL-STD-883, Method 2017.
• Perform Printed Circuit Inspection to IPC-A-600.
• Perform Package Inspection to MIL-STD-883, Method 2009.
• Perform Die Shear Testing to MIL-STD-883, Method 2019.
• Perform Wire bond Testing to MIL-STD-883, Method 2011 and 2023.

Benefits

• medical, vision and dental coverage
• 401k
• paid vacation
• holidays
• sick time
• discretionary performance-based bonus

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: High school or GED