Process InP semiconductor wafers in a cleanroom and ESD-safe environment. Become certified in multiple process areas such as: Photolithography (aligner, stepper, cluster coater, developer, asher), Wet etch (semi-automated and automated tools), Dry etch (ICP, RIE), Thin-film deposition (PECVD), Metallization/plating (Ebeam, Sputter, anneal, liftoff), Lapping/polishing, and Characterization (CDSEM, AFM, profilometer, stressometer, etc.). Handle chemicals (acids, solvents, plating solutions, polishing slurry) with caution and following safety protocol. Follow the process flow using traveler and MES (manufacturing execution system) such as CAMSTAR. Enter wafer characterization data and WIP location information into MES. Interact with engineering for process training and execution of non-standard work instructions on engineering material. Able to record and verify discrepancies using travelers and MES on all testing processes, make modification and escalate issues if needed. Able to stand for duration of shift. Participate and certify for ERT (emergency response team). Ability to provide process training to coworkers using hands-on demonstration and interpretation of agile document.
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Job Type
Full-time
Career Level
Mid Level
Education Level
High school or GED