Wafer Bonding Engineer
About The Position
We are looking for a Bonding Process Development Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve permanent and temporary bonding for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.
Requirements
- Fab processing tools knowledge/experience and how to support defect feedback to process owners.
- 2-4 years of engineering experience.
- MEMS/CMOS/Packaging bonding knowledge with relevant combination of years of experience and/or advanced degree.
- Knowledge of DOE, SPC, and 6-sigma concepts and applications.
- Project Management skills and/or defined training a plus.
- Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
- Can work both independently and in cross-functional teams for problem solving.
- US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
Responsibilities
- Develop and temporary bonding and debonding capabilities for advanced packaging processes using spin-on polymers, laser debond films and tapes.
- Define and maintain automated and manual processes in tape application and temporary bond material deposition.
- Develop and maintain processes in permanent bonding using wafer to wafer techniques such as Hybrid Bonding/DBI.
- Coordinate with appropriate engineering areas to support integration of your processes for bonding and debonding.
- Investigate and drive integration changes for improved device performance and yield improvement.
- Work with process and tool engineers to find processing marginalities and make improvements.
- Routinely monitor selected in line and end of line SPC charts and defects for trends or excursions that can be addressed by integration changes.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Industry
Computer and Electronic Product Manufacturing
Number of Employees
501-1,000 employees
