Staff Process Engineer, APTD Bonding

Micron • Boise, ID

11d

About The Position

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Position Overview: As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Requirements

• BS + 5 years experience, MS + 3 years experience, or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields
• Knowledge of Advanced Package Integration and DRAM, NAND, or other memory
• Ability to manage multiple projects to ensure deliverables are completed on time and on budget
• Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis and data analysis
• Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions
• Ability to resolve complex issues through root-cause or model-based problem solving and adjust to shifting responsibilities and needs of the team.

Responsibilities

• Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods
• Identify, diagnose, and resolve assembly process related problems
• Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step
• Lead/participate in continuous yield improvement and cost reduction activities
• Validate and fan out new process baseline qualified, including new process, tools, and/or materials for new product introduction
• Support SPC/FDC/RMS/APC
• Support site-to-site portability
• Manage/audit material suppliers to achieve quality, cost and risk management objectives

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees